Mergui sylvia (23 risultati)
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MCM C/MIXED TECHNOLOGIES AND THICK FILM SENSORS. (NATO ASI Series)
Jones, W. Kinzy; Kurzweil, Karel; Harsányi, Gábor & Mergui, Sylvia, (editors)
Lingua: Inglese
Editore: Kluwer Academic Publishers, 1995
Serie: Libro 14 di 26 - Nato Science Partnership Subseries: 3
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Da: GfB, the Colchester Bookshop, Colchester, Regno UnitoGfB, the Colchester Bookshop
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EUR 48,15
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Hardcover. Condizione: Good. No d/j. Kluwer Academic Publishers, 1995. Hardback, 8vo, x,318pp, illust. Boards slightly bumped and faded. A good copy. 0792334604/0.8ne.
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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EUR 227,56
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Condizione: New. In.
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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EUR 227,56
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Condizione: New. In.
MCM C/Mixed Technologies and Thick Film Sensors
. Ed(s): Jones, W. Kinzy; Kurzweil, Karel; Harsanyi, Gabor; Mergui, Sylvia
Lingua: Inglese
Editore: Kluwer Academic Publishers, 1995
Serie: Libro 14 di 26 - Nato Science Partnership Subseries: 3
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Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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Condizione: New. Proceedings of the NATO Advanced Research Workshop on 'Advances in Ceramic Multi-Chip Modules (MCM) and High Performance Electronic Materials', Islamorada, Florida, U.S.A., May 23--25, 1994 Editor(s): Jones, W. Kinzy; Kurzweil, Karel; Harsanyi, Gabor; Mergui, Sylvia. Series: NATO Science Partnership Subseries: 3…. Num Pages: 318 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 19. Weight in Grams: 1420. . 1995. Hardback. . . . .
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 277,54
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Condizione: New. pp. x + 318.
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 279,66
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Condizione: New. pp. 332.
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Lingua: Inglese
Editore: Springer Netherlands, Springer Netherlands, 2012
Serie: Libro 14 di 26 - Nato Science Partnership Subseries: 3
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 223,11
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher spe…eds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
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Lingua: Inglese
Editore: Springer Netherlands, Springer Netherlands, 1995
Serie: Libro 14 di 26 - Nato Science Partnership Subseries: 3
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 223,11
EUR 63,32 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and… complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
MCM C/Mixed Technologies and Thick Film Sensors (Nato Science Partnership Subseries: 3 (closed))
Jones, W.K. (Editor) / Kurzweil, Karel (Editor) / Harsányi, Gábor (Editor) / Mergui, Sylvia (Editor)
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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EUR 303,82
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Paperback. Condizione: Brand New. 318 pages. 9.44x6.31x0.75 inches. In Stock.
MCM C/Mixed Technologies and Thick Film Sensors
. Ed(s): Jones, W. Kinzy; Kurzweil, Karel; Harsanyi, Gabor; Mergui, Sylvia
Lingua: Inglese
Editore: Kluwer Academic Publishers, 1995
Serie: Libro 14 di 26 - Nato Science Partnership Subseries: 3
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Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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EUR 323,38
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Condizione: New. Proceedings of the NATO Advanced Research Workshop on 'Advances in Ceramic Multi-Chip Modules (MCM) and High Performance Electronic Materials', Islamorada, Florida, U.S.A., May 23--25, 1994 Editor(s): Jones, W. Kinzy; Kurzweil, Karel; Harsanyi, Gabor; Mergui, Sylvia. Series: NATO Science Partnership Subseries: 3…. Num Pages: 318 pages, biography. BIC Classification: TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 19. Weight in Grams: 1420. . 1995. Hardback. . . . . Books ship from the US and Ireland.
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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EUR 334,65
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Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
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Spedizione gratuitaSpedito in U.S.A.Quantità: Più di 20 disponibili
Condizione: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
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Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
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EUR 175,68
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Condizione: Brand New. New. US edition. Print on demand title. Delivery takes 20-25 days. Excellent Customer Service.
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Lingua: Inglese
Editore: Springer Netherlands Nov 2012, 2012
Serie: Libro 14 di 26 - Nato Science Partnership Subseries: 3
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 167,99
EUR 23,00 spedizioneSpedito da Germania a U.S.A.Quantità: 2 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demand…s for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area. 332 pp. Englisch.
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Lingua: Inglese
Editore: Springer Netherland, 2012
Serie: Libro 14 di 26 - Nato Science Partnership Subseries: 3
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Da: preigu, Osnabrück, Germaniapreigu
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EUR 186,70
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Taschenbuch. Condizione: Neu. MCM C/Mixed Technologies and Thick Film Sensors | W. K. Jones (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2012 | Springer Netherland | EAN 9789401040396 | Verantwortliche Person für die EU: Springer Netherlands, Haberstr. 7, 69126 Heidelberg, buchhandel-buch[at]springer[dot]com |… Anbieter: preigu Print on Demand.
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Lingua: Inglese
Editore: Springer Netherland, 1995
Serie: Libro 14 di 26 - Nato Science Partnership Subseries: 3
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Da: preigu, Osnabrück, Germaniapreigu
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EUR 186,70
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Buch. Condizione: Neu. MCM C/Mixed Technologies and Thick Film Sensors | W. K. Jones (u. a.) | Buch | Einband - fest (Hardcover) | Englisch | 1995 | Springer Netherland | EAN 9780792334606 | Verantwortliche Person für die EU: Springer Netherlands, Haberstr. 7, 69126 Heidelberg, buchhandel-buch[at]springer[dot]com | Anbieter: pre…igu Print on Demand.
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Lingua: Inglese
Editore: Springer Netherlands Apr 1995, 1995
Serie: Libro 14 di 26 - Nato Science Partnership Subseries: 3
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 239,68
EUR 23,00 spedizioneSpedito da Germania a U.S.A.Quantità: 2 disponibili
Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for h…igher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area. 332 pp. Englisch.
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Lingua: Inglese
Editore: Springer Netherlands, Springer Netherlands Apr 1995, 1995
Serie: Libro 14 di 26 - Nato Science Partnership Subseries: 3
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 213,99
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for highe…r speeds and complexity.MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond.MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 332 pp. Englisch.
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Lingua: Inglese
Editore: Springer Netherlands, Springer Netherlands Nov 2012, 2012
Serie: Libro 14 di 26 - Nato Science Partnership Subseries: 3
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 213,99
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands fo…r higher speeds and complexity.MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond.MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 332 pp. Englisch.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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EUR 292,45
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Condizione: New. Print on Demand pp. x + 318.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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EUR 293,89
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Condizione: New. Print on Demand pp. 332 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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Condizione: New. PRINT ON DEMAND pp. x + 318.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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Condizione: New. PRINT ON DEMAND pp. 332.










