Mohd n tamin (20 risultati)

Condizione: New.

Condizione: New.

Condizione: New.

Condizione: New. pp. 187 Softcover reprint of the original 1st ed. 2014 edition NO-PA16APR2015-KAP.

Condizione: New. pp. 190.

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.…

Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.…

Taschenbuch. Condizione: Neu. Solder Joint Reliability Assessment | Finite Element Simulation Methodology | Mohd N. Tamin (u. a.) | Taschenbuch | Advanced Structured Materials | xiii | Englisch | 2016 | Springer | EAN 9783319343013 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Paperback. Condizione: Brand New. reprint edition. 188 pages. 9.25x6.10x0.45 inches. In Stock.

Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: As New. Unread book in perfect condition.

Condizione: new. Questo è un articolo print on demand.

Condizione: new. Questo è un articolo print on demand.

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents a systematic approach in performing reliability assessmentEmphazises accurate quantitative assessment through basic understanding of the mechanics of materialsThe presented simulation methodology is readily applicable to numerous p.…

Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents a systematic approach in performing reliability assessmentEmphazises accurate quantitative assessment through basic understanding of the mechanics of materialsThe presented simulation methodology is readily applicable to numerous p.…

Condizione: New. Print on Demand pp. 187.

Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 188 pp. Englisch.…

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 188 pp. Englisch.…

Condizione: New. PRINT ON DEMAND pp. 187.

Condizione: New. PRINT ON DEMAND pp. 190.