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Reflow Soldering Processes
Da: Recycle Bookstore, San Jose, CA, U.S.A.
Valutazione del venditore 4 su 5 stelle
Hardcover. Condizione: Good. 2002 printing. Book has light wear to the edges and corners, light rubbing to covers, with sporadic light pencil marks and five pages of highlighting, otherwise in good condition. Well-bound with bright and crisp pages.
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Assembly and Reliability of Lead-Free Solder Joints
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. 1st ed. 2020 edition NO-PA16APR2015-KAP.
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Reflow Soldering Processes
Da: Salish Sea Books, Bellingham, WA, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Very Good. Very Good; Hardcover; Covers are still glossy; Unblemished textblock edges; The endpapers and all text pages are clean and unmarked; The binding is excellent with a straight spine; This book will be shipped in a sturdy cardboard box with foam padding; Medium-Large Format (Quatro, 9.75" - 10.75" tall); Purple and yellow covers with title in whtie and blue lettering; 2002, Newnes Publishing; 288 pages; "Reflow Soldering Processes," by Ning-Cheng Lee PhD.
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Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
Da: Mispah books, Redhill, SURRE, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 154,21
Spedizione EUR 29,02
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Assembly and Reliability of Lead-Free Solder Joints
Lingua: Inglese
Editore: Springer Nature Singapore, Springer Nature Singapore, 2021
ISBN 10: 9811539227 ISBN 13: 9789811539220
EUR 127,42
Spedizione EUR 64,71
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
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Assembly and Reliability of Lead-free Solder Joints
Da: Revaluation Books, Exeter, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 188,76
Spedizione EUR 14,51
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 548 pages. 9.25x6.10x0.94 inches. In Stock.
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Assembly and Reliability of Lead-Free Solder Joints
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New.
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Assembly and Reliability of Lead-Free Solder Joints
Lingua: Inglese
Editore: Springer Nature Singapore, Springer Nature Singapore, 2020
ISBN 10: 9811539197 ISBN 13: 9789811539190
EUR 177,00
Spedizione EUR 65,44
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
-
Assembly and Reliability of Lead-Free Solder Joints
Da: Mispah books, Redhill, SURRE, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 262,99
Spedizione EUR 29,02
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: New. New. book.
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Reflow Soldering Processes
Da: Mispah books, Redhill, SURRE, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 323,96
Spedizione EUR 29,02
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrellohardcover. Condizione: Good. Good. Dust Jacket NOT present. CD WILL BE MISSING. . SHIPS FROM MULTIPLE LOCATIONS. book.
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Assembly and Reliability of Lead-Free Solder Joints
Lingua: Inglese
Editore: Springer Nature Singapore Mai 2021, 2021
ISBN 10: 9811539227 ISBN 13: 9789811539220
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Valutazione del venditore 5 su 5 stelle
EUR 123,04
Spedizione EUR 23,00
Spedito da Germania a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products. 552 pp. Englisch.
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Assembly and Reliability of Lead-Free Solder Joints
Lingua: Inglese
Editore: Springer, Berlin|Springer Nature Singapore|Springer, 2021
ISBN 10: 9811539227 ISBN 13: 9789811539220
EUR 102,81
Spedizione EUR 48,99
Spedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics su.
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Assembly and Reliability of Lead-Free Solder Joints
Da: Majestic Books, Hounslow, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 180,59
Spedizione EUR 7,54
Spedito da Regno Unito a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand.
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Assembly and Reliability of Lead-Free Solder Joints
Da: Biblios, Frankfurt am main, HESSE, Germania
Valutazione del venditore 4 su 5 stelle
EUR 181,10
Spedizione EUR 9,95
Spedito da Germania a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND.
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EUR 141,30
Spedizione EUR 48,99
Spedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Offers an exclusive overview of packages and materials available for specified characteristicsIncludes in-depth of mechanism analysisCovers novel materials, including solder alloys and fluxes for advanced applicationsAddresses reliab.
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Assembly and Reliability of Lead-Free Solder Joints
Lingua: Inglese
Editore: Springer Nature Singapore Mai 2020, 2020
ISBN 10: 9811539197 ISBN 13: 9789811539190
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Valutazione del venditore 5 su 5 stelle
EUR 171,19
Spedizione EUR 23,00
Spedito da Germania a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products. 552 pp. Englisch.
-
Assembly and Reliability of Lead-Free Solder Joints
Da: Majestic Books, Hounslow, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 247,78
Spedizione EUR 7,54
Spedito da Regno Unito a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand.
-
Assembly and Reliability of Lead-Free Solder Joints
Da: Biblios, Frankfurt am main, HESSE, Germania
Valutazione del venditore 4 su 5 stelle
EUR 247,73
Spedizione EUR 9,95
Spedito da Germania a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND.
