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ISBN 10: 1627052119 ISBN 13: 9781627052115
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Lingua: Inglese
Editore: Morgan & Claypool Publishers, 2013
ISBN 10: 1627052119 ISBN 13: 9781627052115
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Lingua: Inglese
Editore: Springer International Publishing, 2013
ISBN 10: 3031006461 ISBN 13: 9783031006463
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection applications. Photonics, which has a fundamentally different mechanism of signal propagation, offers the potential to not only overcome the drawbacks of electrical signaling, but also enable the architect to build energy efficient, scalable systems. The purpose of this book is to introduce computer architects to the possibilities and challenges of working with photons and designing on-chip photonic interconnection networks.
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. On-Chip Photonic Interconnects | A Computer Architect's Perspective | Christopher J. Nitta (u. a.) | Taschenbuch | Synthesis Lectures on Computer Architecture | xx | Englisch | 2013 | Springer | EAN 9783031006463 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Lingua: Inglese
Editore: Springer International Publishing Nov 2013, 2013
ISBN 10: 3031006461 ISBN 13: 9783031006463
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection applications. Photonics, which has a fundamentally different mechanism of signal propagation, offers the potential to not only overcome the drawbacks of electrical signaling, but also enable the architect to build energy efficient, scalable systems. The purpose of this book is to introduce computer architects to the possibilities and challenges of working with photons and designing on-chip photonic interconnection networks. 112 pp. Englisch.
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Lingua: Inglese
Editore: Springer, Berlin|Springer International Publishing|Morgan & Claypool|Springer, 2013
ISBN 10: 3031006461 ISBN 13: 9783031006463
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Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors fo.
Lingua: Inglese
Editore: Springer, Palgrave Macmillan Nov 2013, 2013
ISBN 10: 3031006461 ISBN 13: 9783031006463
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As the number of cores on a chip continues to climb, architects will need to address both bandwidth and power consumption issues related to the interconnection network. Electrical interconnects are not likely to scale well to a large number of processors for energy efficiency reasons, and the problem is compounded by the fact that there is a fixed total power budget for a die, dictated by the amount of heat that can be dissipated without special (and expensive) cooling and packaging techniques. Thus, there is a need to seek alternatives to electrical signaling for on-chip interconnection applications. Photonics, which has a fundamentally different mechanism of signal propagation, offers the potential to not only overcome the drawbacks of electrical signaling, but also enable the architect to build energy efficient, scalable systems. The purpose of this book is to introduce computer architects to the possibilities and challenges of working with photons and designing on-chip photonic interconnection networks.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 112 pp. Englisch.