Prasad ray p (45 risultati)

Condizione: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships via media mail.…

Condizione: very_good. Gently read. May have name of previous ownership, or ex-library edition. Binding tight; spine straight and smooth, with no creasing; covers clean and crisp. Minimal signs of handling or shelving. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item! Ships USPS Media Mail.…

hardcover. Condizione: Acceptable. Connecting readers with great books since 1972. Used textbooks may not include companion materials such as access codes, etc. May have condition issues including wear and notes/highlighting. We ship orders daily and Customer Service is our top priority.

hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Condizione: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.

Condizione: Very Good. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

hardcover. Condizione: Very Good. Connecting readers with great books since 1972! Used books may not include companion materials, and may have some shelf wear or limited writing. We ship orders daily and Customer Service is our top priority.

Hard Cover. Condizione: Fine. Condizione sovraccoperta: Fine. 610 pages, illustrated. This book "is the only book of its kind to address all the process and design issues in the field. It will be an invaluable reference for engineers, managers, technicians, and purchasing agents involved in the manufacturing of electronic components, as well as an indispensable text for students of electrical, mechanical, manufacturing, materials, and packaging engineering." FINE HARDCOVER, FINE DUST JACKET. Size: 8vo - over 7¾" - 9¾" tall.…

Hardcover. Condizione: Fine. Condizione sovraccoperta: Fine. Hardback in fine condition with fine condition dust jacket.

Condizione: New.

Condizione: New.

Condizione: New.

Hardcover. Condizione: New. ISBN:9788176222853.

XIII, 1154 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Lecture Notes in Civil Engineering, 171. Sprache: Englisch. …

hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.

Condizione: New. In English.

Condizione: New. pp. 642.

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.…

Taschenbuch. Condizione: Neu. Surface Mount Technology | Principles and Practice | Ray P. Prasad | Taschenbuch | xxiv | Englisch | 2012 | Springer Netherland | EAN 9789401165341 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. …

Condizione: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

Condizione: New.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Condizione: New.

Condizione: New. In English.

Condizione: New. In English.

Condizione: As New. Unread book in perfect condition.

Condizione: New.

Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book gathers peer-reviewed contributions presented at the InternationalConference on Structural Engineering and Construction Management (SECON'21), held on 12-15 May 2021. The meeting served as a fertile platform for discussion, sharing sound knowledge and introducing novel ideas on issues related to sustainable construction and design for the future. The respective contributions address various aspects of numerical modeling and simulation in structural engineering, structural dynamics and earthquake engineering, advanced analysis and design of foundations, BIM, building energy management, and technical project management. Accordingly, the book offers a valuable, up-to-date tool and essential overview of the subject for scientists and practitioners alike, and will inspire further investigations and research.…

Condizione: New.