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Conceptual Design of Multichip Modules and Systems
Da: ThriftBooks-Dallas, Dallas, TX, U.S.A.
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Hardcover. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Corrosion Processes. Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies.
Libro 13 di 18: Structural IntegrityDa: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germania
Membro dell'associazione: GIAQ ILAB VDA
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EUR 20,00
Spedizione EUR 30,00
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Aggiungi al carrelloVII, 339 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Structural Integrity, 13. Sprache: Englisch.
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies (Structural Integrity)
Libro 13 di 18: Structural IntegrityDa: Ria Christie Collections, Uxbridge, Regno Unito
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EUR 115,83
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies: 13 (Structural Integrity, 13)
Libro 13 di 18: Structural IntegrityDa: Chiron Media, Wallingford, Regno Unito
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EUR 113,42
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Aggiungi al carrelloPaperback. Condizione: New.
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies (Structural Integrity)
Libro 13 di 18: Structural IntegrityDa: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. 1st ed. 2020 edition NO-PA16APR2015-KAP.
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies (Structural Integrity, 13)
Libro 13 di 18: Structural IntegrityDa: Ria Christie Collections, Uxbridge, Regno Unito
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EUR 152,55
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Conceptual Design of Multichip Modules and Systems (The Springer International Series in Engineering and Computer Science, 250)
Da: Ria Christie Collections, Uxbridge, Regno Unito
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EUR 164,80
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Corrosion Processes | Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies
Libro 13 di 18: Structural IntegrityEUR 104,15
Spedizione EUR 70,00
Spedito da Germania a U.S.A.Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Corrosion Processes | Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies | George Vachtsevanos (u. a.) | Taschenbuch | Structural Integrity | vii | Englisch | 2021 | Springer | EAN 9783030328337 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Conceptual Design of Multichip Modules and Systems (The Springer International Series in Engineering and Computer Science)
Da: Ria Christie Collections, Uxbridge, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 164,80
Spedizione EUR 13,91
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
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Conceptual Design of Multichip Modules and Systems
Da: GreatBookPrices, Columbia, MD, U.S.A.
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EUR 180,72
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Conceptual Design of Multichip Modules and Systems (The Springer International Series in Engineering and Computer Science, 250)
Da: California Books, Miami, FL, U.S.A.
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EUR 183,13
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Conceptual Design of Multichip Modules and Systems
Da: GreatBookPricesUK, Woodford Green, Regno Unito
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EUR 164,77
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/protection, Diagnosis/Prognosis and Maintenance Strategies
Libro 13 di 18: Structural IntegrityDa: Revaluation Books, Exeter, Regno Unito
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EUR 170,07
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Aggiungi al carrelloPaperback. Condizione: Brand New. 348 pages. 9.25x6.10x0.91 inches. In Stock.
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Corrosion Processes : Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies
Libro 13 di 18: Structural IntegrityLingua: Inglese
Editore: Springer International Publishing, 2021
ISBN 10: 3030328333 ISBN 13: 9783030328337
EUR 117,69
Spedizione EUR 62,64
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses relevant topics in field of corrosion, from sensing strategies to modeling of control processes, corrosion prevention, detection of corrosion initiation, prediction of corrosion growth and evolution, to maintenance practices and return on investment.Written by leading international experts, it combines mathematical and scientific rigor with multiple case studies, examples, colorful images, case studies and numerous references exploring the essentials of corrosion in depth. It appeals to a wide readership, including corrosion engineers, managers, students and industrial and government staff, and can serve as a reference text for courses in materials, mechanical and aerospace engineering, as well as anyone working on corrosion processes.
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EUR 79,33
Spedizione EUR 105,00
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Hervorragend. Zustand: Hervorragend | Seiten: 280 | Sprache: Englisch | Produktart: Bücher | Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
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Corrosion Processes : Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies
Libro 13 di 18: Structural IntegrityEUR 89,01
Spedizione EUR 105,00
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Hervorragend. Zustand: Hervorragend | Seiten: 348 | Sprache: Englisch | Produktart: Bücher | This book discusses relevant topics in field of corrosion, from sensing strategies to modeling of control processes, corrosion prevention, detection of corrosion initiation, prediction of corrosion growth and evolution, to maintenance practices and return on investment.Written by leading international experts, it combines mathematical and scientific rigor with multiple case studies, examples, colorful images, case studies and numerous references exploring the essentials of corrosion in depth. It appeals to a wide readership, including corrosion engineers, managers, students and industrial and government staff, and can serve as a reference text for courses in materials, mechanical and aerospace engineering, as well as anyone working on corrosion processes.
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Integrated Product and Process Design and Development : The Product Realization Process
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: As New. Unread book in perfect condition.
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EUR 140,00
Spedizione EUR 70,00
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Conceptual Design of Multichip Modules and Systems | Peter A. Sandborn (u. a.) | Taschenbuch | xvi | Englisch | 2010 | Springer | EAN 9781441951373 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Conceptual Design of Multichip Modules and Systems
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 276.
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies (Structural Integrity)
Libro 13 di 18: Structural IntegrityDa: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New.
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Conceptual Design of Multichip Modules and Systems
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 280.
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Integrated Product and Process Design and Development : The Product Realization Process
Da: GreatBookPricesUK, Woodford Green, Regno Unito
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EUR 210,19
Spedizione EUR 17,41
Spedito da Regno Unito a U.S.A.Quantità: 15 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
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Corrosion Processes : Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies
Libro 13 di 18: Structural IntegrityLingua: Inglese
Editore: Springer International Publishing, 2020
ISBN 10: 3030328309 ISBN 13: 9783030328306
EUR 160,49
Spedizione EUR 63,44
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book discusses relevant topics in field of corrosion, from sensing strategies to modeling of control processes, corrosion prevention, detection of corrosion initiation, prediction of corrosion growth and evolution, to maintenance practices and return on investment.Written by leading international experts, it combines mathematical and scientific rigor with multiple case studies, examples, colorful images, case studies and numerous references exploring the essentials of corrosion in depth. It appeals to a wide readership, including corrosion engineers, managers, students and industrial and government staff, and can serve as a reference text for courses in materials, mechanical and aerospace engineering, as well as anyone working on corrosion processes.
-
Integrated Product and Process Design and Development : The Product Realization Process
Da: GreatBookPrices, Columbia, MD, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New.
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EUR 168,73
Spedizione EUR 63,45
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
-
EUR 168,73
Spedizione EUR 62,94
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
-
Integrated Product and Process Design and Development : The Product Realization Process
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 238,01
Spedizione EUR 17,41
Spedito da Regno Unito a U.S.A.Quantità: 15 disponibili
Aggiungi al carrelloCondizione: New.
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/protection, Diagnosis/Prognosis and Maintenance Strategies
Libro 13 di 18: Structural IntegrityDa: Revaluation Books, Exeter, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 240,61
Spedizione EUR 14,51
Spedito da Regno Unito a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 339 pages. 9.25x6.25x1.00 inches. In Stock.
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Conceptual Design of Multichip Modules and Systems
Da: GreatBookPricesUK, Woodford Green, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 271,37
Spedizione EUR 17,41
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
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Corrosion Processes: Sensing, Monitoring, Data Analytics, Prevention/Protection, Diagnosis/Prognosis and Maintenance Strategies (Structural Integrity, 13)
Libro 13 di 18: Structural IntegrityDa: Mispah books, Redhill, SURRE, Regno Unito
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EUR 259,43
Spedizione EUR 29,02
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
