Seok seonho (31 risultati)
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Editore: Springer 2018
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Editore: Springer 2019
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Condizione: New. Softcover reprint of the original 1st ed. 2018 edition NO-PA16APR2015-KAP.
Lingua: Inglese
Editore: Springer 2018
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: preigu, Osnabrück, Germaniapreigu
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Taschenbuch. Condizione: Neu. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method | Seonho Seok | Taschenbuch | viii | Englisch | 2019 | Springer International Publishing | EAN 9783030085612 | Verantwortlic…he Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Lingua: Inglese
Editore: Springer International Publishing, Springer International Publishing 2019
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of be…nzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
Lingua: Inglese
Editore: Springer, Berlin, Springer International Publishing, Springer 2018
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocycl…obutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
Lingua: Inglese
Editore: Springer Nature 2019
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: Revaluation Books, Exeter, , Regno UnitoRevaluation Books
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Paperback. Condizione: Brand New. reprint edition. 124 pages. 9.25x6.10x0.28 inches. In Stock.
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Da: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
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HRD. Condizione: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Da: PBShop.store UK, Fairford, GLOS, Regno UnitoPBShop.store UK
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HRD. Condizione: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Da: Majestic Books, Hounslow, , Regno UnitoMajestic Books
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condizione: New. Print on Demand.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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Condizione: New. PRINT ON DEMAND.
Lingua: Inglese
Editore: Springer 2018
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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Condizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer 2019
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Buch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding tech…nologies, one paper on vacuum packaging, and three papers on modeling and simulation.
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Da: moluna, Greven, , Germaniamoluna
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Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. KlappentextrnrnThis Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow three papers on biocompatible implantable packaging, three p…apers on interconnect, three papers on.
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Da: preigu, Osnabrück, Germaniapreigu
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Buch. Condizione: Neu. MEMS Packaging Technologies and 3D Integration | Buch | Gebunden | Englisch | 2022 | MDPI AG | EAN 9783036542584 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.
Lingua: Inglese
Editore: Springer International Publishing Jan 2019 2019
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, , GermaniaBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as…a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. 124 pp. Englisch.
Lingua: Inglese
Editore: Berlin Springer International Publishing Springer Mai 2018 2018
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, , GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 149,79
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a funct…ion of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. 115 pp. Englisch.
Lingua: Inglese
Editore: Springer International Publishing 2019
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: moluna, Greven, , Germaniamoluna
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Introduces a new and unique packaging technologyExplains microelectromechanical systems (MEMS) packaging utilizing polymers or thin filmsDiscusses finite element method (FEM) modeling to explain the technology from a… theoretical perspective.
Lingua: Inglese
Editore: Springer International Publishing 2018
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: moluna, Greven, , Germaniamoluna
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EUR 128,41
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Introduces a new and unique packaging technologyExplains microelectromechanical systems (MEMS) packaging utilizing polymers or thin filmsDiscusses finite element method (FEM) modeling to explain the technology from a… theoretical perspective.
Lingua: Inglese
Editore: Springer 2019
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: Majestic Books, Hounslow, , Regno UnitoMajestic Books
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Condizione: New. Print on Demand.
Lingua: Inglese
Editore: Springer 2018
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: Majestic Books, Hounslow, , Regno UnitoMajestic Books
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Condizione: New. Print on Demand.
Lingua: Inglese
Editore: Springer International Publishing, Springer International Publishing Jan 2019 2019
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 149,79
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films ¿ a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a fu…nction of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load¿displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 124 pp. Englisch.
Lingua: Inglese
Editore: Springer 2019
Serie: Springer Series in Advanced Manufacturing, Libro 50 di 74. Libro 50 di 74 - Springer Series in Advanced Manufacturing
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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EUR 204,53
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Condizione: New. PRINT ON DEMAND.
