Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Pistil Books Online, IOBA, Seattle, WA, U.S.A.
Membro dell'associazione: IOBA
Hard Cover. Condizione: Fine. No Jacket. A clean, unmarked book with a tight binding. 278 pages.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 290.
hardcover. Condizione: As New. Ships Out Tomorrow!
Da: Majestic Books, Hounslow, Regno Unito
EUR 122,42
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New. pp. 290 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 123,34
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: New. pp. 290.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 127,72
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 290.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 164,36
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Lingua: Inglese
Editore: Springer US, Springer New York, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 120,54
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Da: Buchpark, Trebbin, Germania
EUR 83,27
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Hervorragend. Zustand: Hervorragend | Seiten: 278 | Sprache: Englisch | Produktart: Bücher | Back Cover CopySERIES:Integrated Circuits and Systems 3D-Integration for NoC-based SoC Architectures by: (Editors)Abbas Sheibanyrad Frédéric Petrot Axel Janstch This book investigates on the promises, challenges, and solutions for the 3D Integration (vertically stacking) of embedded systems connected via a network on a chip. It covers the entire architectural design approach for 3D-SoCs. 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures have emerged as topics critical for current R&D leading to a broad range of products. This book presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures. ¿Presents a comprehensive, system-level overview of three-dimensional architectures and micro-architectures; ¿Covers the entire architectural design approach for 3D-SoCs;¿Includes state-of-the-art treatment of 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 182,43
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 168,73
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 217,01
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 94,25
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 126,26
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer New York Dez 2012, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 117,69
Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 288 pp. Englisch.
Da: moluna, Greven, Germania
EUR 98,54
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-.
Da: Majestic Books, Hounslow, Regno Unito
EUR 160,34
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 290 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 161,72
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 290.
Lingua: Inglese
Editore: Springer, Springer Dez 2012, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 117,69
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 288 pp. Englisch.
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 160,49
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 278 pp. Englisch.
Da: moluna, Greven, Germania
EUR 137,26
Quantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-.