Sheibanyrad abbas (28 risultati)

Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Hard Cover. Condizione: Fine. No Jacket. A clean, unmarked book with a tight binding. 278 pages.

hardcover. Condizione: As New. Ships Out Tomorrow.

Condizione: Used. pp. 290.

Condizione: New.

Condizione: Used. pp. 290 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Condizione: Used. pp. 290.

Condizione: New. pp. 290.

Taschenbuch. Condizione: Neu. 3D Integration for NoC-based SoC Architectures | Abbas Sheibanyrad (u. a.) | Taschenbuch | Integrated Circuits and Systems | x | Englisch | 2012 | Springer | EAN 9781461427483 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Condizione: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

Condizione: New.

Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.…

Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: As New. Unread book in perfect condition.

Hardcover. Condizione: gut. 2010. 3D Integration for Noc-Based Soc Architectures In englischer Sprache. pages.

Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: As New. Unread book in perfect condition.

Condizione: new. Questo è un articolo print on demand.

Condizione: new. Questo è un articolo print on demand.

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 288 pp. Englisch.…

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-.…

Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.…

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 288 pp. Englisch.…

Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 278 pp. Englisch.…

Condizione: New. Print on Demand pp. 290 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.

Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Provides a detailed background on the state of error control methods for on-chip interconnects, including Error Control Coding, Double Sampling, and On-Line TestingDescribes the use of more complex concatenated codes such as Hamming Product Codes with Type-.…

Condizione: New. PRINT ON DEMAND pp. 290.