Sreenivas rao (29 risultati)

Condizione: New. pp. 234.

Condizione: New. pp. xiii + 621 Illus.

Condizione: New. pp. xiii + 621.

Condizione: New. pp. xiii + 621.

Soft cover. Condizione: New. This guide comprehensively explores workflows for modern torpedo design, bridging theoretical principles with practical application. It offers a structured approach integrating engineering practices with technical data, making it highly useful for professionals, researchers and students. Key topics include hydrodynamic configuration, sensor design, power requirements, stability, and control mechanisms. The book covers critical aspects such as shell design, material selection, onboard computing, monitoring, safety measures, and considerations for both exercise and combat torpedoes. Deployment strategies for aerial launches from helicopters and fixed-wing aircraft are discussed, emphasizing safety and compatibility certification. The guide also examines launchers, fire control computers, and rigorous testing protocols to ensure reliability and operational readiness. It reflects the development cycle, from conceptual design to validation, adhering to a systematic engineering process. Designed with a systems engineering perspective, it offers cross-disciplinary insights, building foundational expertise for designing and developing underwater weapon systems. It serves students, engineers, defence personnel, researchers, and scientists, equipping readers to contribute meaningfully to underwater weaponry. …

Condizione: New. pp. pp. xxvi + 612.

Condizione: New. A brand new book in pristine condition. Showing zero signs of shelf wear, creases, or damage.

Hardcover. Condizione: new. Hardcover. This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 2223, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Condizione: New.

Condizione: New.

Taschenbuch. Condizione: Neu. Innovations in Signal Processing and Embedded Systems | Proceedings of ICISPES 2021 | Jyotsna Kumar Mandal (u. a.) | Taschenbuch | Algorithms for Intelligent Systems | xiv | Englisch | 2023 | Springer | EAN 9789811916717 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Condizione: New.

Condizione: New. pp. pp. xxvi + 612.

Condizione: Hervorragend. Zustand: Hervorragend | Seiten: 512 | Sprache: Englisch | Produktart: Bücher | This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22¿23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS.…

Hardcover. Condizione: Brand New. 512 pages. 9.25x6.10x1.26 inches. In Stock.

Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS.…

paperback. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS.…

Condizione: New. pp. pp. xxvi + 612.

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Gopal Krishna U.B.B.E: Mechanical Engineering from Malnad College of Engineering, Hassan VTU,Karnataka , India.M.Tech: Studied Manufacturing Science and Engineering at Siddaganga Institute of Technology, Tumkur,karnataka, India.Assis.…

Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Metal Matrix Composites (MMCs) have been developed to meet the demand for lighter materials with high specific strength, stiffness and wear resistance properties. Particulate reinforced aluminium matrix composites (AMCs) are attractive materials due to their strength, ductility and toughness. Their ability to be produced by conventional methods adds to the advantage. The aluminium matrix can be strengthened by reinforcing with hard ceramic particles like SiC, Al2O3 and B4C etc. Judicious selection of the variables is important to optimize the properties of composites. In this work an effort is made to enhance the mechanical properties like tensile strength and hardness of AMCs by reinforcing 6061Al matrix with B4C particles. By stir casting route, aluminium matrix was reinforced with boron carbide particulates of 37, 44, 63, 105, 250µ sizes. The micro-structure and mechanical properties of the fabricated AMCs were analyzed. The optical micro-structure images reveal the homogeneous dispersion of B4C particles in the matrix. The tensile strength and hardness were found to increase with the increase in the particle size.…

Condizione: new. Questo è un articolo print on demand.

Condizione: new. Questo è un articolo print on demand.

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS. 512 pp. Englisch.…

Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS. 512 pp. Englisch.…

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 512 pp. Englisch.…

Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 512 pp. Englisch.…

Condizione: New. Print on Demand.

Condizione: New. PRINT ON DEMAND.