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Paperback. Condizione: new. Paperback. The world of automatic control surrounds us so completely that its workings largely escape notice. A washing machine faithfully sequences through its wash cycle, an automobile's engine control unit adjusts fuel injection thousands of times per minute, and an industrial bottling line fills, caps, and labels thousands of containers per hour - all governed by embedded computing intelligence that operates silently, reliably, and, for the most part, invisibly. This book was conceived to illuminate that intelligence: to explain, in a rigorous yet accessible manner, both the general-purpose embedded systems that pervade consumer and industrial products alike, and the specialised, industrially hardened class of embedded controller known as the Programmable Logic Controller (PLC) that governs the vast majority of the world's factories, process plants, and infrastructure.The decision to treat embedded systems and PLCs within a single, unified volume, rather than as two entirely separate subjects, was deliberate and, I believe, pedagogically important. As Chapter 18 of this book argues at length, a PLC is not a fundamentally different technology from a general-purpose embedded system, but rather a specialised, ruggedised, and standardised category within the broader embedded-systems domain - sharing the same underlying microcontroller architectures, the same fundamental concepts of sensors, actuators, interrupts, and real-time scheduling, and, increasingly in modern industrial practice, converging technologies such as the soft PLC. A student or practising engineer who understands both domains, and appreciates their relationship, is far better equipped for a career in modern automation, mechatronics, or embedded product engineering than one who has studied only one in isolation.This book is organised into three parts. Part I (Chapters 1-9) lays the foundation of embedded systems: their definition, classification, and application domains; hardware architecture, processors, and memory systems; sensors, actuators, and signal conditioning; communication interfacing; embedded software development; real-time operating systems; and design methodology. Part II (Chapters 10-17) turns to Programmable Logic Controllers in comparable depth: their history and architecture; the IEC 61131-3 family of programming languages, with particular emphasis on ladder logic; timers, counters, and sequencing; industrial communication networks; SCADA and HMI systems; and practical installation, troubleshooting, and maintenance. Part III (Chapters 18-20) draws the two domains together through direct comparison, a series of worked industrial case studies, and a forward-looking examination of Industry 4.0 and the Industrial Internet of Things.Throughout the book, I have aimed to balance conceptual rigour with practical relevance. Each chapter concludes with a set of review questions intended to consolidate understanding and support use of this book in a formal academic course, while original figures, diagrams, and tables - prepared specifically for this book - are provided throughout to support visual as well as textual understanding of the material. Every effort has been made to verify technical claims, standards references, and historical facts against authoritative and current sources prior to inclusion in this text.This book is intended primarily for undergraduate and postgraduate students of electronics, electrical, instrumentation, mechatronics, and industrial automation engineering, as well as for practising engineers and technicians seeking a structured, comprehensive reference spanning both embedded systems and PLC technology. No prior background beyond basic digital electronics and elementary programming concepts is assumed, though readers with some prior exposure to either subject will find the integrated treatment offered here Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Paperback. Condizione: new. Paperback. Aviation stands at a technological inflection point comparable to the transition from piston engines to jet propulsion in the mid-twentieth century. Electric and hybrid-electric propulsion, once confined to conceptual studies and small experimental airframes, are now the subject of serious investment by airframers, regulators, and airlines. This textbook was written to give students, practicing engineers, and researchers a single, structured reference that spans the full breadth of the subject: the electric machines and power electronics that move electrons into thrust, the batteries and fuel cells that store the energy, the airframe architectures that make use of electrification, and the certification, economic, and environmental questions that determine whether these aircraft will actually enter widespread service.The book is organized to be read either cover to cover as a semester-length course, or consulted chapter by chapter as a reference. Part I lays the historical and conceptual foundation. Part II builds the core technology base - electric machines, power electronics, batteries, fuel cells, electrical distribution, and thermal management - treating each as a discipline in its own right while continually relating it back to the aircraft-level consequences of mass, volume, and reliability. Part III addresses how these technologies come together at the vehicle level: propulsion architectures, distributed electric propulsion and its aerodynamic coupling, conceptual sizing methods, and structural and weight considerations. Part IV steps back to the wider system: safety and certification, a survey of real programs and what can be learned from them, ground infrastructure, environmental impact, and the economics and outlook for the sector.A deliberate choice has been made throughout to be candid about the limits of current technology. Battery specific energy remains roughly an order of magnitude below that of jet fuel on a usable-energy basis, and this single fact shapes almost every design decision described in this book - from the bias toward short-range, small-aircraft applications, to the popularity of hybrid and turboelectric architectures that mitigate rather than eliminate the energy-storage gap, to the emphasis on distributed propulsion and aerodynamic integration as a way of extracting efficiency gains that do not depend on breakthroughs in cell chemistry. Where the state of the art is genuinely uncertain - for example, the pace of solid-state battery maturation, or which regional-aircraft programs will reach certification - the text says so rather than presenting speculation as settled fact.Numerical values quoted for specific programs (masses, powers, ranges, dates) are drawn from publicly available manufacturer and regulator sources current at the time of writing and are intended to illustrate orders of magnitude and design trends rather than to serve as authoritative specifications; the electric-aviation landscape changes quickly, and readers pursuing current figures for a specific program should consult that manufacturer's or regulator's own published data. Many of the quantitative design relationships in Chapters 12 and 13 are presented as first-order, conceptual-design-level methods appropriate for early trade studies; they are not a substitute for the detailed, certified analysis required in an actual type-certification program.I am grateful to the broader community of electric-aviation researchers, from the university laboratories that built the first electric motorgliders to the NASA, EASA, and FAA teams whose public technical reports and lessons-learned documents have done a great service to the field by being unusually candid about what has and has not worked. This book leans heavily on that shared, published body of work, and any errors of interpretation are my own. T Shipping may be from multiple locations in the US or from the UK, depending on stock availability. …

Paperback. Condizione: new. Paperback. The idea for this book grew out of a simple observation: while through-silicon vias, silicon interposers, and chiplet-based design have moved from research curiosities to the technologies underpinning nearly every leading-edge AI accelerator, server processor, and premium mobile system-on-chip shipped today, no single text had brought together the full breadth of this subject - from the physics of via etching to the economics of chiplet partitioning to the standards governing die-to-die interfaces - in one coherent, classroom- and practice-ready volume. This book is my attempt to fill that gap.3D and 2.5D integration sit at an unusually rich intersection of disciplines. A practicing engineer in this field must be conversant with semiconductor process technology (to understand what a foundry or OSAT partner can actually manufacture), with circuit and physical design (to build a chiplet that will function correctly once assembled), with thermal and mechanical engineering (because heat and stress, not merely electrical signals, ultimately determine whether a stacked assembly survives its intended product lifetime), and increasingly with system architecture and even supply-chain economics (because the decision to partition a system into chiplets is as much a business decision as a technical one). I have tried, throughout this book, to give each of these dimensions its due, rather than treating 3D/2.5D integration as a narrowly circuit-level or narrowly process-level topic.The book is organized to be read either sequentially, as a complete course of study, or selectively, by readers seeking depth in a particular subtopic. Part I establishes motivation and foundational packaging concepts. Part II works through the core enabling interconnect technologies - TSVs, interposers, redistribution layers, bonding, and stacking architectures - in the order a design team would typically encounter them when planning a new 3D/2.5D product. Part III addresses chiplet-based system design and the commercial packaging platforms that realize it in production. Part IV, the longest section of the book, treats the cross-cutting engineering disciplines - power delivery, signal integrity, thermal management, test, EDA methodology, design optimization, and reliability - that determine whether a 3D/2.5D system actually works, not merely in simulation but in high-volume manufacturing and in the field. Part V closes with applications and a look toward emerging research directions.This book is intended for graduate students and advanced undergraduates in electrical engineering, computer engineering, and materials science; for practicing engineers moving into advanced packaging, physical design, or system architecture roles who need a structured introduction to this field; and for technical managers and program leads who need enough fluency across the full breadth of the subject to make informed partitioning, packaging, and technology-selection decisions. Each chapter is written to be self-contained enough to serve as a standalone reference, while cross-references throughout connect related material across chapters for readers working through the book sequentially.The field this book describes is evolving rapidly, and any snapshot of specific commercial platforms, standard revisions, or process capabilities will inevitably age faster than the underlying physical principles and design disciplines that govern them. I have tried, wherever possible, to emphasize those durable principles - the physics of TSV parasitics, the economics of yield-driven partitioning, the systems-level logic of thermal-electrical-power co-design - over specific numbers that will shift with the next process generation, while still grounding the discussion in concrete, representative figures that give the reader a genuine feel for the scales involved. This it Shipping may be from multiple locations in the US or from the UK, depending on stock availability. …

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Taschenbuch. Condizione: Neu. Neuware.

Taschenbuch. Condizione: Neu. Neuware - Unmanned Aerial Vehicles have moved, within the span of a single professional career, from a specialized military niche to one of the most rapidly diversifying branches of aerospace engineering. A student entering this field today must understand not only classical flight mechanics but also brushless motor control, GNSS-denied navigation, machine-learning-based perception, spectrum-constrained radio communication, and a regulatory landscape that continues to be rewritten year by year. This breadth is precisely what makes UAV technology exciting to teach and difficult to write about comprehensively - and it is the gap this book attempts to close.This textbook is written for senior undergraduate and graduate students in aerospace, mechanical, electrical, and computer engineering, as well as for practicing engineers, researchers, and technically-minded regulators and policy analysts who need a rigorous but accessible single-volume reference spanning the full UAV technology stack - from airframe aerodynamics through propulsion, flight control, navigation, communication, and real-world applications. Each part of the book can, to a reasonable extent, be read independently by readers with the appropriate prerequisite background (undergraduate-level dynamics, control theory, and signals and systems are assumed throughout), while the book as a whole is sequenced to build cumulatively, from historical and regulatory foundations in Part I, through physical design in Parts II and III, to control, autonomy, communication, and application in Parts IV through VI.A note on scope and currency: unmanned systems regulation, in particular, changes faster than any printed text can track in real time. Every regulatory figure, date, and threshold cited in this book has been checked against publicly available primary sources - statutes, final rules, and standards documents - current as of the time of writing, and is presented with its governing authority and, where practical, its effective date, so that readers can independently verify currency against the relevant national aviation authority before relying on it operationally.Every diagram, schematic, and system architecture figure in this book has been newly drawn for this text to illustrate general engineering principles; none reproduce proprietary manufacturer drawings, and all are captioned with their conceptual sources. Tables of comparative specifications synthesize publicly available data from manufacturer documentation, peer-reviewed literature, and government sources cited in each chapter's reference list.I am grateful to the broader community of UAV researchers, standards bodies, and open-source autopilot developers whose published work made a text of this breadth possible, and to the students whose questions, over many years of teaching flight mechanics and autonomous systems, shaped which explanations belong in a book like this one.…

Taschenbuch. Condizione: Neu. Neuware.

Paperback. Condizione: new. Paperback. Aviation stands at a technological inflection point comparable to the transition from piston engines to jet propulsion in the mid-twentieth century. Electric and hybrid-electric propulsion, once confined to conceptual studies and small experimental airframes, are now the subject of serious investment by airframers, regulators, and airlines. This textbook was written to give students, practicing engineers, and researchers a single, structured reference that spans the full breadth of the subject: the electric machines and power electronics that move electrons into thrust, the batteries and fuel cells that store the energy, the airframe architectures that make use of electrification, and the certification, economic, and environmental questions that determine whether these aircraft will actually enter widespread service.The book is organized to be read either cover to cover as a semester-length course, or consulted chapter by chapter as a reference. Part I lays the historical and conceptual foundation. Part II builds the core technology base - electric machines, power electronics, batteries, fuel cells, electrical distribution, and thermal management - treating each as a discipline in its own right while continually relating it back to the aircraft-level consequences of mass, volume, and reliability. Part III addresses how these technologies come together at the vehicle level: propulsion architectures, distributed electric propulsion and its aerodynamic coupling, conceptual sizing methods, and structural and weight considerations. Part IV steps back to the wider system: safety and certification, a survey of real programs and what can be learned from them, ground infrastructure, environmental impact, and the economics and outlook for the sector.A deliberate choice has been made throughout to be candid about the limits of current technology. Battery specific energy remains roughly an order of magnitude below that of jet fuel on a usable-energy basis, and this single fact shapes almost every design decision described in this book - from the bias toward short-range, small-aircraft applications, to the popularity of hybrid and turboelectric architectures that mitigate rather than eliminate the energy-storage gap, to the emphasis on distributed propulsion and aerodynamic integration as a way of extracting efficiency gains that do not depend on breakthroughs in cell chemistry. Where the state of the art is genuinely uncertain - for example, the pace of solid-state battery maturation, or which regional-aircraft programs will reach certification - the text says so rather than presenting speculation as settled fact.Numerical values quoted for specific programs (masses, powers, ranges, dates) are drawn from publicly available manufacturer and regulator sources current at the time of writing and are intended to illustrate orders of magnitude and design trends rather than to serve as authoritative specifications; the electric-aviation landscape changes quickly, and readers pursuing current figures for a specific program should consult that manufacturer's or regulator's own published data. Many of the quantitative design relationships in Chapters 12 and 13 are presented as first-order, conceptual-design-level methods appropriate for early trade studies; they are not a substitute for the detailed, certified analysis required in an actual type-certification program.I am grateful to the broader community of electric-aviation researchers, from the university laboratories that built the first electric motorgliders to the NASA, EASA, and FAA teams whose public technical reports and lessons-learned documents have done a great service to the field by being unusually candid about what has and has not worked. This book leans heavily on that shared, published body of work, and any errors of interpretation are my Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability. …

Taschenbuch. Condizione: Neu. Neuware.

Taschenbuch. Condizione: Neu. Neuware.

Paperback. Condizione: new. Paperback. The world of automatic control surrounds us so completely that its workings largely escape notice. A washing machine faithfully sequences through its wash cycle, an automobile's engine control unit adjusts fuel injection thousands of times per minute, and an industrial bottling line fills, caps, and labels thousands of containers per hour - all governed by embedded computing intelligence that operates silently, reliably, and, for the most part, invisibly. This book was conceived to illuminate that intelligence: to explain, in a rigorous yet accessible manner, both the general-purpose embedded systems that pervade consumer and industrial products alike, and the specialised, industrially hardened class of embedded controller known as the Programmable Logic Controller (PLC) that governs the vast majority of the world's factories, process plants, and infrastructure.The decision to treat embedded systems and PLCs within a single, unified volume, rather than as two entirely separate subjects, was deliberate and, I believe, pedagogically important. As Chapter 18 of this book argues at length, a PLC is not a fundamentally different technology from a general-purpose embedded system, but rather a specialised, ruggedised, and standardised category within the broader embedded-systems domain - sharing the same underlying microcontroller architectures, the same fundamental concepts of sensors, actuators, interrupts, and real-time scheduling, and, increasingly in modern industrial practice, converging technologies such as the soft PLC. A student or practising engineer who understands both domains, and appreciates their relationship, is far better equipped for a career in modern automation, mechatronics, or embedded product engineering than one who has studied only one in isolation.This book is organised into three parts. Part I (Chapters 1-9) lays the foundation of embedded systems: their definition, classification, and application domains; hardware architecture, processors, and memory systems; sensors, actuators, and signal conditioning; communication interfacing; embedded software development; real-time operating systems; and design methodology. Part II (Chapters 10-17) turns to Programmable Logic Controllers in comparable depth: their history and architecture; the IEC 61131-3 family of programming languages, with particular emphasis on ladder logic; timers, counters, and sequencing; industrial communication networks; SCADA and HMI systems; and practical installation, troubleshooting, and maintenance. Part III (Chapters 18-20) draws the two domains together through direct comparison, a series of worked industrial case studies, and a forward-looking examination of Industry 4.0 and the Industrial Internet of Things.Throughout the book, I have aimed to balance conceptual rigour with practical relevance. Each chapter concludes with a set of review questions intended to consolidate understanding and support use of this book in a formal academic course, while original figures, diagrams, and tables - prepared specifically for this book - are provided throughout to support visual as well as textual understanding of the material. Every effort has been made to verify technical claims, standards references, and historical facts against authoritative and current sources prior to inclusion in this text.This book is intended primarily for undergraduate and postgraduate students of electronics, electrical, instrumentation, mechatronics, and industrial automation engineering, as well as for practising engineers and technicians seeking a structured, comprehensive reference spanning both embedded systems and PLC technology. No prior background beyond basic digital electronics and elementary programming concepts is assumed, though readers with some prior exposure to either subject will find the integrated treatment Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Taschenbuch. Condizione: Neu. Neuware.

Taschenbuch. Condizione: Neu. Neuware.

Taschenbuch. Condizione: Neu. Neuware.

Taschenbuch. Condizione: Neu. Neuware.

Taschenbuch. Condizione: Neu. Neuware.

Taschenbuch. Condizione: Neu. Neuware.

Condizione: New.

Taschenbuch. Condizione: Neu. Neuware.

Taschenbuch. Condizione: Neu. Neuware.

Taschenbuch. Condizione: Neu. Neuware.

Taschenbuch. Condizione: Neu. Neuware.

Taschenbuch. Condizione: Neu. Neuware - This book grew out of a simple observation: the field of artificial intelligence for semiconductor design has, within the span of little more than a decade, evolved from a handful of academic curiosities into a body of techniques that touches nearly every stage of how modern chips are conceived, designed, verified, and manufactured. Yet much of the literature documenting this evolution remains scattered across conference papers, vendor white papers, and specialized workshops, without a single volume attempting to draw these threads together into a coherent, comprehensive account suitable for graduate students, practicing engineers, and technology strategists alike.This book aims to fill that gap. It is written for readers who bring either a computer science and machine learning background and wish to understand the specifics of semiconductor design, or an electrical engineering and VLSI design background and wish to understand how contemporary AI techniques apply to their domain. Chapters are organized to be reasonably self-contained, with cross-references connecting related material, so that readers may approach the book either sequentially, as a complete course of study, or selectively, focusing on the chapters most relevant to their specific interests.Throughout, I have tried to balance two competing instincts: the desire to convey genuine enthusiasm for what AI has already demonstrably achieved in this field, and an equally important commitment to methodological honesty about what remains uncertain, unproven, or actively debated - most notably in the discussion of reinforcement-learning-based floorplanning in Chapter 13, where I have tried to present both the genuine excitement the original results generated and the important scientific scrutiny that followed. My hope is that readers come away from this book not merely informed about a set of techniques, but equipped with the critical, evidence-based judgment needed to evaluate new claims as this fast-moving field continues to evolve.I am grateful to the broader community of researchers, engineers, and educators whose published work, conference presentations, and open technical discussions have shaped the understanding this book attempts to synthesize. Any errors of fact or interpretation that remain are, of course, my own.…

Condizione: New.

Paperback. Condizione: new. Paperback. The idea for this book grew out of a simple observation: while through-silicon vias, silicon interposers, and chiplet-based design have moved from research curiosities to the technologies underpinning nearly every leading-edge AI accelerator, server processor, and premium mobile system-on-chip shipped today, no single text had brought together the full breadth of this subject - from the physics of via etching to the economics of chiplet partitioning to the standards governing die-to-die interfaces - in one coherent, classroom- and practice-ready volume. This book is my attempt to fill that gap.3D and 2.5D integration sit at an unusually rich intersection of disciplines. A practicing engineer in this field must be conversant with semiconductor process technology (to understand what a foundry or OSAT partner can actually manufacture), with circuit and physical design (to build a chiplet that will function correctly once assembled), with thermal and mechanical engineering (because heat and stress, not merely electrical signals, ultimately determine whether a stacked assembly survives its intended product lifetime), and increasingly with system architecture and even supply-chain economics (because the decision to partition a system into chiplets is as much a business decision as a technical one). I have tried, throughout this book, to give each of these dimensions its due, rather than treating 3D/2.5D integration as a narrowly circuit-level or narrowly process-level topic.The book is organized to be read either sequentially, as a complete course of study, or selectively, by readers seeking depth in a particular subtopic. Part I establishes motivation and foundational packaging concepts. Part II works through the core enabling interconnect technologies - TSVs, interposers, redistribution layers, bonding, and stacking architectures - in the order a design team would typically encounter them when planning a new 3D/2.5D product. Part III addresses chiplet-based system design and the commercial packaging platforms that realize it in production. Part IV, the longest section of the book, treats the cross-cutting engineering disciplines - power delivery, signal integrity, thermal management, test, EDA methodology, design optimization, and reliability - that determine whether a 3D/2.5D system actually works, not merely in simulation but in high-volume manufacturing and in the field. Part V closes with applications and a look toward emerging research directions.This book is intended for graduate students and advanced undergraduates in electrical engineering, computer engineering, and materials science; for practicing engineers moving into advanced packaging, physical design, or system architecture roles who need a structured introduction to this field; and for technical managers and program leads who need enough fluency across the full breadth of the subject to make informed partitioning, packaging, and technology-selection decisions. Each chapter is written to be self-contained enough to serve as a standalone reference, while cross-references throughout connect related material across chapters for readers working through the book sequentially.The field this book describes is evolving rapidly, and any snapshot of specific commercial platforms, standard revisions, or process capabilities will inevitably age faster than the underlying physical principles and design disciplines that govern them. I have tried, wherever possible, to emphasize those durable principles - the physics of TSV parasitics, the economics of yield-driven partitioning, the systems-level logic of thermal-electrical-power co-design - over specific numbers that will shift with the next process generation, while still grounding the discussion in concrete, representative figures that give the reader a genuine feel for the scales invo Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability. …

Taschenbuch. Condizione: Neu. Neuware.