Wong ban p (24 risultati)

Condizione: Very Good. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condizione: New. pp. xv + 385.

Condizione: New. pp. xv + 385 Illus.

HRD. Condizione: New. New Book. Shipped from UK. Established seller since 2000.

Condizione: New. pp. xv + 385.

Condizione: new.

Condizione: New.

Condizione: New.

Hardcover. Condizione: New. Brand new book, sourced directly from publisher. Dispatch time is 3-4 days from our warehouse. Book will be sent in robust, secure packaging to ensure it reaches you securely.

Hardback. Condizione: New. New copy - Usually dispatched within 4 working days.

Condizione: New.

Condizione: New. In English.

Condizione: New. The current semiconductor model continues to give birth to a large number of design engineers who are producing a large number of chips, but without any interaction with process/device people. This book addresses major challenges faced by engineers and offers concrete solutions provided by industry experts. Num Pages: 386 pages, Illustrations. BIC Classification: TG; TJFD. Category: (P) Professional & Vocational. Dimension: 232 x 164 x 22. Weight in Grams: 688. . 2008. 1st Edition. Hardcover. . . . .…

Condizione: As New. Unread book in perfect condition.

Condizione: As New. Unread book in perfect condition.

Condizione: New. The current semiconductor model continues to give birth to a large number of design engineers who are producing a large number of chips, but without any interaction with process/device people. This book addresses major challenges faced by engineers and offers concrete solutions provided by industry experts. Num Pages: 386 pages, Illustrations. BIC Classification: TG; TJFD. Category: (P) Professional & Vocational. Dimension: 232 x 164 x 22. Weight in Grams: 688. . 2008. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland.…

Condizione: New. BRAND NEW. book.

Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Hardcover. Condizione: Brand New. 1st edition. 393 pages. 9.50x6.50x1.00 inches. In Stock.

Hardback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 718.

Hardcover. Condizione: new. Hardcover. Discover innovative tools that pave the way from circuit and physical design to fabrication processing Nano-CMOS Design for Manufacturability examines the challenges that design engineers face in the nano-scaled era, such as exacerbated effects and the proven design for manufacturability (DFM) methodology in the midst of increasing variability and design process interactions. In addition to discussing the difficulties brought on by the continued dimensional scaling in conformance with Moore's law, the authors also tackle complex issues in the design process to overcome the difficulties, including the use of a functional first silicon to support a predictable product ramp. Moreover, they introduce several emerging concepts, including stress proximity effects, contour-based extraction, and design process interactions. This book is the sequel to Nano-CMOS Circuit and Physical Design, taking design to technology nodes beyond 65nm geometries. It is divided into three parts: Part One, Newly Exacerbated Effects, introduces the newly exacerbated effects that require designers' attention, beginning with a discussion of the lithography aspects of DFM, followed by the impact of layout on transistor performance Part Two, Design Solutions, examines how to mitigate the impact of process effects, discussing the methodology needed to make sub-wavelength patterning technology work in manufacturing, as well as design solutions to deal with signal, power integrity, WELL, stress proximity effects, and process variability Part Three, The Road to DFM, describes new tools needed to support DFM efforts, including an auto-correction tool capable of fixing the layout of cells with multiple optimization goals, followed by a look ahead into the future of DFM Throughout the book, real-world examples simplify complex concepts, helping readers see how they can successfully handle projects on Nano-CMOS nodes. It provides a bridge that allows engineers to go from physical and circuit design to fabrication processing and, in short, make designs that are not only functional, but that also meet power and performance goals within the design schedule. The current semiconductor model continues to give birth to a large number of design engineers who are producing a large number of chips, but without any interaction with process/device people. This book addresses major challenges faced by engineers and offers concrete solutions provided by industry experts. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Hardcover. Condizione: Brand New. 1st edition. 393 pages. 9.50x6.50x1.00 inches. In Stock. This item is printed on demand.

Hardback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 705.