Yasha yi (19 risultati)

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  • Lingua: Inglese

    Editore: Springer, 2025

    3031915070 / 9783031915079

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  • Lingua: Inglese

    Editore: Springer International Publishing AG, Cham, 2025

    3031915070 / 9783031915079

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    Hardcover. Condizione: new. Hardcover. The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

  • Lingua: Inglese

    Editore: Springer, 2025

    3031915070 / 9783031915079

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    Da: California Books, Miami, FL, U.S.A.California Books

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  • Lingua: Inglese

    Editore: Springer, 2025

    3031915070 / 9783031915079

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    Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices

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  • Lingua: Inglese

    Editore: Springer, 2025

    3031915070 / 9783031915079

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    Da: Books Puddle, Woodside, NY, U.S.A.Books Puddle

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    EUR 93,00

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  • Lingua: Inglese

    Editore: Springer Nature, 2025

    3031915070 / 9783031915079

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    Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books

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    EUR 83,23

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    Hardcover. Condizione: Brand New. 223 pages. 9.44x6.61x9.45 inches. In Stock.

  • Lingua: Inglese

    Editore: Springer, 2026

    3031915100 / 9783031915109

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    Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH

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    EUR 62,95

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    Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed.…

  • Lingua: Inglese

    Editore: Springer, 2025

    3031915070 / 9783031915079

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    Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH

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    Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed.…

  • Lingua: Inglese

    Editore: Springer, 2026

    3031915100 / 9783031915109

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    Da: preigu, Osnabrück, Germaniapreigu

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    EUR 50,45

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    Taschenbuch. Condizione: Neu. From 2D to 3D Photonic Integrated Circuits | Yasha Yi | Taschenbuch | Synthesis Lectures on Emerging Engineering Technologies | xv | Englisch | 2026 | Springer | EAN 9783031915109 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

  • Lingua: Inglese

    Editore: Springer International Publishing AG, Cham, 2025

    3031915070 / 9783031915079

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    EUR 96,88

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    Hardcover. Condizione: new. Hardcover. The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

  • Lingua: Inglese

    Editore: Springer, 2025

    3031915070 / 9783031915079

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    Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand

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    EUR 46,22

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    Condizione: new. Questo è un articolo print on demand.

  • Lingua: Inglese

    Editore: Springer, Berlin, Springer Jun 2026, 2026

    3031915100 / 9783031915109

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    Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

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    EUR 53,49

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    Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed. 208 pp. Englisch. …

  • Lingua: Inglese

    Editore: Springer, Springer Jun 2025, 2025

    3031915070 / 9783031915079

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    Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.

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    Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed. 224 pp. Englisch.…

  • Lingua: Inglese

    Editore: Springer Verlag GmbH, 2026

    3031915100 / 9783031915109

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    Da: moluna, Greven, Germaniamoluna

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    Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt.

  • Lingua: Inglese

    Editore: Springer Verlag GmbH, 2025

    3031915070 / 9783031915079

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    • Print on Demand

    Da: moluna, Greven, Germaniamoluna

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    Condizione: Nuovo

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    Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt.

  • Lingua: Inglese

    Editore: Springer, 2025

    3031915070 / 9783031915079

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    Da: Majestic Books, Hounslow, Regno UnitoMajestic Books

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    EUR 92,29

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  • Lingua: Inglese

    Editore: Springer, 2025

    3031915070 / 9783031915079

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    Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios

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    EUR 89,90

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    Condizione: New. PRINT ON DEMAND.

  • Lingua: Inglese

    Editore: Palgrave Macmillan Jun 2026, 2026

    3031915100 / 9783031915109

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    Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000

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    Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities. This book provides an introduction to photonic integrated circuits and the transition from 2D to 3D PICs. It then describes design and fabrication techniques of 3D PICs and related challenges and solutions. Finally, applications of 3D photonics, emerging technologies and industry outlook are also discussed.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 224 pp. Englisch.…

  • Lingua: Inglese

    Editore: Springer, Birkhäuser Jun 2025, 2025

    3031915070 / 9783031915079

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    Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000

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    Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The integration of photonics and electronics has transformed the landscape of modern technology. At the forefront of this revolution is the development of Photonic Integrated Circuits (PICs). Historically rooted in the traditional 2-D fabrication processes inherited from electronic Integrated Circuits, PICs shifted to 3-D configurations, introducing new design philosophies that impact scalability, efficiency, and performance. This convergence of electronic and photonic circuits presents unique challenges and great opportunities.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 224 pp. Englisch.…