hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Da: Ria Christie Collections, Uxbridge, Regno Unito
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Da: GreatBookPrices, Columbia, MD, U.S.A.
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Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 115,58
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Aggiungi al carrelloCondizione: New.
Lingua: Inglese
Editore: Springer-Verlag New York Inc., US, 2006
ISBN 10: 0387257624 ISBN 13: 9780387257624
Da: Rarewaves.com USA, London, LONDO, Regno Unito
EUR 144,82
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Aggiungi al carrelloHardback. Condizione: New. 2006 ed.
Lingua: Inglese
Editore: Springer-Verlag New York Inc., US, 2006
ISBN 10: 0387257624 ISBN 13: 9780387257624
Da: Rarewaves.com UK, London, Regno Unito
EUR 136,16
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Aggiungi al carrelloHardback. Condizione: New. 2006 ed.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 194,46
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 184,93
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Da: Buchpark, Trebbin, Germania
EUR 104,61
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Aggiungi al carrelloCondizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Thermal modeling of high performance circuits and systems is a crucial component for thermal and power management. The VLSI community is currently lacking a methodology to model and estimate junction temperature at any level of design other than low-level (transistor-level) circuits. The accuracy of thermal modeling has a substantial effect on the accuracy of thermal-management studies at the architectural level. Without this essential modeling capability, architecture researchers are limited to inaccurate estimation techniques, which are not suitable for thermal management of integrated circuits.In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime.This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 217,93
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Da: moluna, Greven, Germania
EUR 93,00
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Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the latest research that has been carried on in the area of thermal and power management of integrated circuits with emphasis on performance and reliability of ICs at system and circuit levelNo book provides cohesive treatment of the materi.