hardcover. Condizione: As New. 2nd. Ships Out Tomorrow!
Condizione: very_good. This books is in Very good condition. There may be a few flaws like shelf wear and some light wear.
hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
hardcover. Condizione: As New. Ships Out Tomorrow!
Da: HPB-Red, Dallas, TX, U.S.A.
paperback. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 113,52
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Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 130,70
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Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 113,51
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Da: Buchpark, Trebbin, Germania
EUR 29,90
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Aggiungi al carrelloCondizione: Sehr gut. Zustand: Sehr gut | Seiten: 352 | Sprache: Englisch | Produktart: Bücher | Defect-oriented testing methods have come a long way from a mere interesting academic exercise to a hard industrial reality. Many factors have contributed to its industrial acceptance. Traditional approaches of testing modern integrated circuits have been found to be inadequate in terms of quality and economics of test. In a globally competitive semiconductor market place, overall product quality and economics have become very important objectives. In addition, electronic systems are becoming increasingly complex and demand components of the highest possible quality. Testing in general and defect-oriented testing in particular help in realizing these objectives. For contemporary System on Chip (SoC) VLSI circuits, testing is an activity associated with every level of integration. However, special emphasis is placed for wafer-level test, and final test. Wafer-level test consists primarily of dc or slow-speed tests with current/voltage checks per pin under most operating conditions and with test limits properly adjusted. Basic digital tests are applied and in some cases low-frequency tests to ensure analog/RF functionality are exercised as well. Final test consists of checking device functionality by exercising RF tests and by applying a comprehensive suite of digital test methods such as I , delay fault testing, DDQ stuck-at testing, low-voltage testing, etc. This partitioning choice is actually application dependent.
Lingua: Inglese
Editore: Springer-Verlag New York Inc., US, 2006
ISBN 10: 0387257624 ISBN 13: 9780387257624
Da: Rarewaves.com USA, London, LONDO, Regno Unito
EUR 143,70
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Aggiungi al carrelloHardback. Condizione: New. 2006 ed.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 192.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 137,52
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Aggiungi al carrelloCondizione: New. In.
Condizione: New. pp. 352 2nd Edition.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 161,51
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Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 161,51
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Aggiungi al carrelloCondizione: New. In.
Condizione: New.
Lingua: Inglese
Editore: Springer US, Springer New York, 2010
ISBN 10: 144193832X ISBN 13: 9781441938329
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 112,77
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime.This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 161,50
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Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 173,51
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Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 173,51
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Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 171,16
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 174,75
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Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 192,45
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Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 183,01
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Aggiungi al carrelloHardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Lingua: Inglese
Editore: Springer-Verlag New York Inc., US, 2006
ISBN 10: 0387257624 ISBN 13: 9780387257624
Da: Rarewaves.com UK, London, Regno Unito
EUR 134,75
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Aggiungi al carrelloHardback. Condizione: New. 2006 ed.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 215,67
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: preigu, Osnabrück, Germania
EUR 149,00
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. CMOS SRAM Circuit Design and Parametric Test in Nano-Scaled Technologies | Process-Aware SRAM Design and Test | Manoj Sachdev (u. a.) | Taschenbuch | xvi | Englisch | 2010 | Springer | EAN 9789048178551 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Condizione: New. pp. 212.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 221,50
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Aggiungi al carrelloCondizione: New. In.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 248.