9780387765327 - wafer level 3-d ics process technology (11 risultati)
Lingua: Inglese
Editore: Springer, 2008
Serie: Integrated Circuits and Systems, Libro 20 di 34. Libro 20 di 34 - Integrated Circuits and Systems
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Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Lingua: Inglese
Editore: Springer, 2008
Serie: Integrated Circuits and Systems, Libro 20 di 34. Libro 20 di 34 - Integrated Circuits and Systems
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Da: Basi6 International, Irving, TX, U.S.A.Basi6 International
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Lingua: Inglese
Editore: Springer, 2008
Serie: Integrated Circuits and Systems, Libro 20 di 34. Libro 20 di 34 - Integrated Circuits and Systems
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Wafer Level 3-D ICs Process Technology
Tan, Chuan Seng (EDT); Gutmann, Ronald J. (EDT); Reif, L. Rafael (EDT); List, Scott (FRW)
Lingua: Inglese
Editore: Springer, 2008
Serie: Integrated Circuits and Systems, Libro 20 di 34. Libro 20 di 34 - Integrated Circuits and Systems
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condizione: New.
Lingua: Inglese
Editore: Springer, Springer, 2008
Serie: Integrated Circuits and Systems, Libro 20 di 34. Libro 20 di 34 - Integrated Circuits and Systems
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry's vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form fac…tor of a system with a xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today's trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ows, and functional diversi cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren't vertically stacked strata endemic to the semiconductor industry The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.
Lingua: Inglese
Editore: Springer Verlag, 2008
Serie: Integrated Circuits and Systems, Libro 20 di 34. Libro 20 di 34 - Integrated Circuits and Systems
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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Hardcover. Condizione: Brand New. 1st edition. 410 pages. 9.75x9.50x0.75 inches. In Stock.
Lingua: Inglese
Editore: Springer, 2008
Serie: Integrated Circuits and Systems, Libro 20 di 34. Libro 20 di 34 - Integrated Circuits and Systems
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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Wafer Level 3-D ICs Process Technology
Tan, Chuan Seng (EDT); Gutmann, Ronald J. (EDT); Reif, L. Rafael (EDT); List, Scott (FRW)
Lingua: Inglese
Editore: Springer, 2008
Serie: Integrated Circuits and Systems, Libro 20 di 34. Libro 20 di 34 - Integrated Circuits and Systems
- Rilegato
Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condizione: As New. Unread book in perfect condition.
Lingua: Inglese
Editore: Springer US Sep 2008, 2008
Serie: Integrated Circuits and Systems, Libro 20 di 34. Libro 20 di 34 - Integrated Circuits and Systems
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed di…scussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry. 376 pp. Englisch.
Lingua: Inglese
Editore: Springer US, 2008
Serie: Integrated Circuits and Systems, Libro 20 di 34. Libro 20 di 34 - Integrated Circuits and Systems
- Rilegato
- Print on Demand
Da: moluna, Greven, Germaniamoluna
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Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Focuses on the foundry-based process technology for the fabrication of 3-D ICsDiscusses the technology platform for pre-packaging wafer level 3-D ICsIncludes chapters contributed by various experts in the f…ield of wafer-level 3-D ICs proces.
Lingua: Inglese
Editore: Springer, Springer Sep 2008, 2008
Serie: Integrated Circuits and Systems, Libro 20 di 34. Libro 20 di 34 - Integrated Circuits and Systems
- Rilegato
- Print on Demand
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry¿s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency,…and form factor of a system with a xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamental motivation behind 3D technologies which vertically stack several strata of device and interconnect layers with high vertical interconnectivity. In addition, the ability to vertically stack strata with - vergent and even incompatible process ows provides for low cost and low parasitic integration of diverse technologies such as sensors, energy scavengers, nonvolatile memory, dense memory, fast memory, processors, and RF layers. These capabilities coupled with today¿s trends of increasing levels of integrated functionality, lower power, smaller form factor, increasingly divergent process ows, and functional diversi cation would seem to make 3D technologies a natural choice for most of the semiconductor industry. Since the concept of vertical integration of different strata has been around for over 20 years, why aren¿t vertically stacked strata endemic to the semiconductor industry The simple answer to this question is that in the past, the 3D advantages while interesting were not necessary due to the tremendous opportunities offered by geometric scaling. In addition, even when the global interconnect problem of high-performance single-core processors seemed insurmountable without inno- tions such as 3D, alternative architectural solutions such as multicores could eff- tivelydelaybutnoteliminatetheneedfor3D.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 376 pp. Englisch.
