Da: thebookforest.com, San Rafael, CA, U.S.A.
Condizione: Like New. Page block firm and clean, binding unblemished, boards straight, without markings of any kind. Fine, like new condition. Extremely fine. Previous owners name on the inside of front endpaper. Well packaged and promptly shipped from California. Partnered with Friends of the Library since 2010.
Da: BennettBooksLtd, Los Angeles, CA, U.S.A.
Hardcover. Condizione: New. In shrink wrap. Looks like an interesting title!
EUR 303,29
Quantità: 10 disponibili
Aggiungi al carrelloCondizione: New.
Da: Chiron Media, Wallingford, Regno Unito
EUR 300,35
Quantità: 5 disponibili
Aggiungi al carrelloHardcover. Condizione: New.
Condizione: New.
Condizione: As New. Unread book in perfect condition.
EUR 330,09
Quantità: 10 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Condizione: New. pp. 568.
EUR 325,10
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. M. Datta, Tetsuya Osaka, J. Walter SchultzeMicroelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the.
EUR 399,11
Quantità: 3 disponibili
Aggiungi al carrelloCondizione: New. pp. 568.
Lingua: Inglese
Editore: Taylor & Francis Ltd Dez 2004, 2004
ISBN 10: 041531190X ISBN 13: 9780415311908
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 392,08
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Neuware - Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, then discusses chip metallization topics. It explores key aspects of chip-package interconnect technologies, and analyzes packages, boards, and connectors. It concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools.
Da: Majestic Books, Hounslow, Regno Unito
EUR 352,49
Quantità: 3 disponibili
Aggiungi al carrelloCondizione: New. pp. 568 Illus. This item is printed on demand.