Microelectronic Packaging - Rilegato

 
9780415311908: Microelectronic Packaging
Rilegato
ISBN 10: 041531190X ISBN 13: 9780415311908
Casa editrice: CRC Press, 2004

Sinossi

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

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Informazioni sull?autore

M. Datta, Tetsuya Osaka, J. Walter Schultze

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Editore
CRC Press
Data di pubblicazione
2004
Lingua
Inglese
ISBN 10 
041531190X
ISBN 13 
9780415311908
Rilegatura
Copertina rigida
Numero edizione
1
Numero di pagine
564
Redattore
Datta M., Osaka Tetsuya, Schultze J. Walter
Contatto del produttore
non disponibile
Persona responsabile
non disponibile