Isbn: 9780471974017 - integrated circuit failure analysis: a guide to preparation techniques (22 risultati)

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Condizione: Good. : Este libro es una guía práctica para el análisis de fallos en circuitos integrados. Describe procedimientos avanzados para exponer los sitios de fallo en dispositivos semiconductores, adoptando un enfoque práctico basado en la experiencia. Incluye métodos avanzados en la preparación de dispositivos, técnicas para la inspección de paquetes y la fiabilidad de los semiconductores, así como ilustraciones del aislamiento de chips y la eliminación de capas mediante técnicas químicas y de plasma. Se centra en circuitos bipolares y MOS, pero las técnicas son aplicables a otros semiconductores. Además, ofrece consejos sobre la elección del equipo de laboratorio adecuado. EAN: 9780471974017 Tipo: Libros Categoría: Tecnología Título: Integrated Circuit Failure Analysis Autor: Friedrich Beck Editorial: Wiley Idioma: en Páginas: 190 Formato: tapa dura.…

Condizione: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

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Condizione: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. ? Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. ? Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. ? Advice on the choice of suitable laboratory equipment. ? Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text will enable both academic and industrial researchers and IC designers to expand the range of analytical and preparative methods at their disposal and to adapt to the needs of new technologies.…

Condizione: New.

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hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.

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Condizione: New. In English.

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Condizione: New. The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a discipline in its own right. Series: Quality and Reliability Engineering Series. Num Pages: 190 pages, index. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate; (XV) Technical / Manuals. Dimension: 246 x 161 x 16. Weight in Grams: 432. . 1998. 1st Edition. Hardcover. . . . . …

Condizione: New. pp. 190.

Gebunden. Condizione: New. The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a disci.

Condizione: New. pp. 190 1st Edition.

Hardcover. Condizione: Brand New. 1st edition. 190 pages. 9.75x6.50x0.50 inches. In Stock.

Buch. Condizione: Neu. Neuware - Funktionstests an integrierten Schaltungen sind für deren Zuverlässigkeit von herausragender Bedeutung. Erstmals werden in diesem Werk die speziellen Präparationstechniken für die Fehleranalyse beschrieben. Ausgehend von den theoretischen Grundlagen erläutert der Autor in praxisnahem Stil die verschiedenen Techniken, die das Zurückverfolgen von Ausfällen ermöglichen.…

Condizione: New. The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a discipline in its own right. Series: Quality and Reliability Engineering Series. Num Pages: 190 pages, index. BIC Classification: TJFC; TJFD5. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate; (XV) Technical / Manuals. Dimension: 246 x 161 x 16. Weight in Grams: 432. . 1998. 1st Edition. Hardcover. . . . . Books ship from the US and Ireland. …

Hardcover. Condizione: new. Hardcover. Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. Advice on the choice of suitable laboratory equipment. Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text will enable both academic and industrial researchers and IC designers to expand the range of analytical and preparative methods at their disposal and to adapt to the needs of new technologies. The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a discipline in its own right. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.…

Hardcover. Condizione: Brand New. 1st edition. 190 pages. 9.75x6.50x0.50 inches. In Stock. This item is printed on demand.