Lingua: Inglese
Editore: New York, NY, Springer New York., 2015
ISBN 10: 1461408202 ISBN 13: 9781461408208
Da: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germania
EUR 14,00
Quantità: 2 disponibili
Aggiungi al carrelloed. 2015 235 mm x 155 mm. XVI, 233 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Stemped. Sprache: Englisch.
EUR 56,42
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: New. BRAND NEW hardcover. Book.
EUR 101,06
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
EUR 111,70
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In English.
Condizione: New. pp. 300.
EUR 150,30
Quantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 233 pages. 9.25x6.25x0.75 inches. In Stock.
Lingua: Inglese
Editore: Springer New York, Springer New York Nov 2014, 2014
ISBN 10: 1461408202 ISBN 13: 9781461408208
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 106,99
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Neuware -This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 252 pp. Englisch.
Lingua: Inglese
Editore: Springer New York, Springer New York, 2014
ISBN 10: 1461408202 ISBN 13: 9781461408208
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 111,53
Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits.
EUR 165,82
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 86,24
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer New York Nov 2014, 2014
ISBN 10: 1461408202 ISBN 13: 9781461408208
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 106,99
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers layout design and layout migration methodologies for optimizing multi-net wire structures in advanced VLSI interconnects. Scaling-dependent models for interconnect power, interconnect delay and crosstalk noise are covered in depth, and several design optimization problems are addressed, such as minimization of interconnect power under delay constraints, or design for minimal delay in wire bundles within a given routing area. A handy reference or a guide for design methodologies and layout automation techniques, this book provides a foundation for physical design challenges of interconnect in advanced integrated circuits. 252 pp. Englisch.
Da: moluna, Greven, Germania
EUR 89,99
Quantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Describes the evolution of interconnect scaling and provides new techniques for layout migration and optimization, focusing on multi-net optimizationPresents research results that provide a level of design optimization which does not exist in comm.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 144,71
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 300.