9781461426257 - moisture sensitivity of plastic packages of ic devices (8 risultati)
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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EUR 276,84
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Condizione: New. In.
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Da: preigu, Osnabrück, Germaniapreigu
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EUR 229,75
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Taschenbuch. Condizione: Neu. Moisture Sensitivity of Plastic Packages of IC Devices | X. J. Fan (u. a.) | Taschenbuch | Micro- and Opto-Electronic Materials, Structures, and Systems | xiv | Englisch | 2012 | Springer | EAN 9781461426257 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelbe…rg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 277,49
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical ap…proaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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EUR 384,70
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Paperback. Condizione: Brand New. 572 pages. 9.20x6.10x1.33 inches. In Stock.
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Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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EUR 206,31
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Condizione: new. Questo è un articolo print on demand.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical an…d theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike. 588 pp. Englisch.
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Da: moluna, Greven, Germaniamoluna
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EUR 223,97
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presented in a systematic manner based on lectures and tutorials by the authorsFocused on improved reliability in plastic packagingProvides theory and new industry applicationsMoisture Sensitivity of Plastic Packages… of IC Devices provides information o.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 267,49
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and th…eoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field.Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 588 pp. Englisch.
