9781493954384 - wafer-level chip-scale packaging: analog and power semiconductor applications di qu, shichun; liu, yong (12 risultati)
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Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
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EUR 171,04
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Paperback. Condizione: Brand New. reprint edition. 339 pages. 9.25x6.10x0.80 inches. In Stock.
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Da: Buchpark, Trebbin, GermaniaBuchpark
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EUR 79,98
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Condizione: Sehr gut. Zustand: Sehr gut | Seiten: 340 | Sprache: Englisch | Produktart: Bücher | Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLC…SP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
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Da: preigu, Osnabrück, Germaniapreigu
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EUR 149,00
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Taschenbuch. Condizione: Neu. Wafer-Level Chip-Scale Packaging | Analog and Power Semiconductor Applications | Yong Liu (u. a.) | Taschenbuch | xvii | Englisch | 2016 | Springer New York | EAN 9781493954384 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]spr…inger[dot]com | Anbieter: preigu.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 179,61
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging a…re presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 312,19
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Condizione: New. pp. 339.
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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EUR 299,57
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Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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- Print on Demand
Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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EUR 134,27
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Condizione: new. Questo è un articolo print on demand.
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Da: moluna, Greven, Germaniamoluna
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EUR 144,94
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Kartoniert / Broschiert. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Covers the development of wafer level power discrete packaging with regular wafer level design concept and directly bumping technologyIntroduces the development of the analog and power SIP/3D…/TSV/stack die packaging technologyPresents the w.
Lingua: Inglese
Editore: Springer New York, Chapman And Hall/CRC Aug 2016 2016
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 171,19
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic W…LCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book. 340 pp. Englisch.
Lingua: Inglese
Editore: Springer New York, Springer New York Aug 2016 2016
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 171,19
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP… packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 340 pp. Englisch.
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Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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EUR 315,09
EUR 7,53 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 4 disponibili
Condizione: New. Print on Demand pp. 339.
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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EUR 314,41
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Condizione: New. PRINT ON DEMAND pp. 339.
