Isbn: 9783031947940 - electronic materials innovations and reliability in advanced memory packaging (10 risultati)

Hardcover. Condizione: new. Hardcover. This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.…

Condizione: New.

Hardcover. Condizione: Brand New. 280 pages. 9.25x6.10x9.32 inches. In Stock.

Condizione: new. Questo è un articolo print on demand.

Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt.

Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level. 196 pp. Englisch.…

Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 196 pp. Englisch.…

Condizione: New. Print on Demand.

Condizione: New. PRINT ON DEMAND.