Importo totale (1 articolo articoli):
Destinazione ordine:
9783540223696 - Integrating Modeling Of Chemical Mechanical Planarization For Sub-Micron IC Fabrication: From Particle Scale To Feature, Die And Wafer Scales di Luo, Jainfeng; Dorn... (20 risultati)
Vai alla pagina principale dei risultati di ricerca
Filtri di ricerca
Tipo di articolo
- Tutti i tipi di prodotto
- Libri (20)
- Riviste e Giornali (Nessun altro risultato corrispondente a questo perfezionamento)
- Fumetti (Nessun altro risultato corrispondente a questo perfezionamento)
- Spartiti (Nessun altro risultato corrispondente a questo perfezionamento)
- Arte, Stampe e Poster (Nessun altro risultato corrispondente a questo perfezionamento)
- Fotografie (Nessun altro risultato corrispondente a questo perfezionamento)
- Mappe (Nessun altro risultato corrispondente a questo perfezionamento)
- Manoscritti e Collezionismo cartaceo (Nessun altro risultato corrispondente a questo perfezionamento)
Condizioni Maggiori informazioni
- Nuovo (18)
- Come nuovo, Ottimo o Quasi ottimo (1)
- Molto buono o Buono (1)
- Discreto o Mediocre (Nessun altro risultato corrispondente a questo perfezionamento)
- Come descritto (Nessun altro risultato corrispondente a questo perfezionamento)
Legatura
- Tutte
- Rilegato (20)
- Brossura (Nessun altro risultato corrispondente a questo perfezionamento)
Ulteriori caratteristiche
- Prima ed. (Nessun altro risultato corrispondente a questo perfezionamento)
- Copia autograf. (Nessun altro risultato corrispondente a questo perfezionamento)
- Sovracoperta (Nessun altro risultato corrispondente a questo perfezionamento)
- Con foto (5)
- Non Print on Demand (17)
Lingua (1)
Prezzo
- Qualsiasi prezzo
- Inferiore a EUR 20 (Nessun altro risultato corrispondente a questo perfezionamento)
- EUR 20 a EUR 45 (Nessun altro risultato corrispondente a questo perfezionamento)
- Superiore a EUR 45
Spedizione gratuita
Paese del venditore
Valutazione venditore
-
Integrated Modeling Of Chemical Mechanical Planarization For Sub-Micron Ic Fabrication
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
-
Integrated Modeling Of Chemical Mechanical Planarization For Sub-Micron Ic Fabrication
Da: Basi6 International, Irving, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
-
Integrated Modeling Of Chemical Mechanical Planarization For Sub Micron Ic Fabrication (Hb 2004)
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
-
Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
-
Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
-
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
Da: Books Puddle, New York, NY, U.S.A.
Valutazione del venditore 4 su 5 stelle
Condizione: New. pp. 340.
-
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
Da: Majestic Books, Hounslow, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 110,08
Spedizione EUR 7,52
Spedito da Regno Unito a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. 340 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
-
Integrated Modeling Of Chemical Mechanical Planarization For Sub Micron Ic Fabrication (Hb 2004)
Da: Basi6 International, Irving, TX, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
-
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
Da: Biblios, Frankfurt am main, HESSE, Germania
Valutazione del venditore 4 su 5 stelle
EUR 108,84
Spedizione EUR 9,95
Spedito da Germania a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. 340.
-
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
Da: Ria Christie Collections, Uxbridge, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 164,21
Spedizione EUR 13,86
Spedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
-
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
Lingua: Inglese
Editore: Springer Berlin Heidelberg, 2004
ISBN 10: 354022369X ISBN 13: 9783540223696
EUR 136,16
Spedizione EUR 48,99
Spedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New.
-
Integrated Modeling Of Chemical Mechanical Planarization For Sub-Micron IC Fabrication: From Particle Scale to Feature, Die And Wafer Scales
Da: The Book Spot, Sioux Falls, MN, U.S.A.
Valutazione del venditore 5 su 5 stelle
Hardcover. Condizione: New.
-
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication : From Particle Scale to Feature, Die and Wafer Scales
Lingua: Inglese
Editore: Springer Berlin Heidelberg, Springer Berlin Heidelberg, 2004
ISBN 10: 354022369X ISBN 13: 9783540223696
EUR 160,49
Spedizione EUR 63,35
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an 'integrated model' and, more specifically, we include the important role of the mechanical elements of the process.
-
Edizione InternazionaleINTEGRATED MODELING OF CHEMICAL MECHANICAL PLANARIZATION FOR SUB MICRON IC FABRICATION (HB 2004)
Da: UK BOOKS STORE, London, LONDO, Regno Unito
Valutazione del venditore 5 su 5 stelle
EUR 282,28
Spedizione EUR 6,93
Spedito da Regno Unito a U.S.A.Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
-
Integrated Modeling Of Chemical Mechanical Planarization For Sub-Micron IC Fabrication: From Particle Scale to Feature, Die And Wafer Scales
Da: Mispah books, Redhill, SURRE, Regno Unito
Valutazione del venditore 4 su 5 stelle
EUR 285,91
Spedizione EUR 28,91
Spedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.
-
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabri David A. Dornfeld
Lingua: Inglese
Editore: Springer Berlin Heidelberg, Springer Berlin, 2004
ISBN 10: 354022369X ISBN 13: 9783540223696
Da: BUCHSERVICE / ANTIQUARIAT Lars Lutzer, Wahlstedt, Germania
Valutazione del venditore 4 su 5 stelle
EUR 299,90
Spedizione EUR 39,95
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: gut. 2004. Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabri In deutscher Sprache. pages.
-
Integrated Modeling Of Chemical Mechanical Planarization For Sub-Micron IC Fabrication: From Particle Scale to Feature, Die And Wafer Scales [Hardcover] Jianfeng Luo and David Dornfeld
Da: The Book Spot, Sioux Falls, MN, U.S.A.
Valutazione del venditore 5 su 5 stelle
Condizione: New. (inventory#Shelf).
-
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
Lingua: Inglese
Editore: Springer Berlin Heidelberg Okt 2004, 2004
ISBN 10: 354022369X ISBN 13: 9783540223696
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
Valutazione del venditore 5 su 5 stelle
EUR 160,49
Spedizione EUR 23,00
Spedito da Germania a U.S.A.Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an 'integrated model' and, more specifically, we include the important role of the mechanical elements of the process. 336 pp. Englisch.
-
EUR 141,20
Spedizione EUR 70,00
Spedito da Germania a U.S.A.Quantità: 5 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication | From Particle Scale to Feature, Die and Wafer Scales | David A. Dornfeld (u. a.) | Buch | xxiv | Englisch | 2004 | Springer-Verlag GmbH | EAN 9783540223696 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
-
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
Lingua: Inglese
Editore: Springer Berlin Heidelberg, Springer Berlin Heidelberg Okt 2004, 2004
ISBN 10: 354022369X ISBN 13: 9783540223696
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
Valutazione del venditore 5 su 5 stelle
EUR 160,49
Spedizione EUR 60,00
Spedito da Germania a U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an 'integrated model' and, more specifically, we include the important role of the mechanical elements of the process.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 336 pp. Englisch.
