Da: BMV Bloor, Toronto, ON, Canada
EUR 17,75
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Very Good. Used - Very Good.
Da: SpringBooks, Berlin, Germania
Prima edizione
EUR 20,80
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: As New. 1. Auflage. Unread, like new. Immediately dispatched from Germany.
Condizione: New. pp. 59.
Lingua: Inglese
Editore: Springer Berlin Heidelberg, 2016
ISBN 10: 366249681X ISBN 13: 9783662496817
Da: moluna, Greven, Germania
EUR 48,37
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Lingua: Inglese
Editore: Springer Berlin Heidelberg, 2016
ISBN 10: 366249681X ISBN 13: 9783662496817
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 53,49
Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600 and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10-7 -cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node.
Da: Buchpark, Trebbin, Germania
EUR 17,34
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600¿ and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10¿7¿¿cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 46,22
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Lingua: Inglese
Editore: Springer Berlin Heidelberg Jun 2016, 2016
ISBN 10: 366249681X ISBN 13: 9783662496817
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 53,49
Quantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600 and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10-7 -cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node. 80 pp. Englisch.
Da: Majestic Books, Hounslow, Regno Unito
EUR 73,22
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 59.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 68,79
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 59.
Lingua: Inglese
Editore: Springer, Springer Jun 2016, 2016
ISBN 10: 366249681X ISBN 13: 9783662496817
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 53,49
Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600¿ and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10¿7¿¿cm2, respectively. Besides, a reduced source/drain parasitic resistance is demonstrated in the fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 80 pp. Englisch.
Da: preigu, Osnabrück, Germania
EUR 50,25
Quantità: 5 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. The Source/Drain Engineering of Nanoscale Germanium-based MOS Devices | Zhiqiang Li | Buch | Springer Theses | xiv | Englisch | 2016 | Springer | EAN 9783662496817 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.