9786200458964 - Optimization of area and power of 3D integrated circuits: Optimization of Area and Power of Three-Dimensional Integrated Circuits (3D ICs) di Lal, Roop; Raghuvanshi... (8 risultati)

Condizione: New.

Taschenbuch. Condizione: Neu. Optimization of area and power of 3D integrated circuits | Optimization of Area and Power of Three-Dimensional Integrated Circuits (3D ICs) | Roop Lal (u. a.) | Taschenbuch | Englisch | 2019 | LAP LAMBERT Academic Publishing | EAN 9786200458964 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Three-dimensional (3D) Integrated Circuits (ICs) has emerged as a new technology providing noticeable solutions to alleviate problems like greater power consumption, longer interconnects with large delays, etc. In 3D ICs, have multiple layers stacked one above the other. Vertical integration of multiple layers scales up the performance of electronic devices beyond Moore¿s law. It drastically decreases the interconnect length which directly results in increased speed and also combines various technologies (digital, analog, memory, etc.) in a single product, thereby greatly extending the capabilities of System-on-Chip. The objective of this book is to investigate the effects of core utilization on the core and chip area for obtaining the optimal sets of core utilization so that the core and chip area of the 3D ICs can be reduced. Cadence Encounter-to-GDSII has been used for optimization while performing physical designing of the 3D ICs. The literature survey has revealed that majority of the optimization has been performed only at any one of the stages of physical designing while in this book we have done research optimization at three different stages of physical designing. 100 pp. Englisch.

Condizione: New. Print on Demand.

Kartoniert / Broschiert. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Lal RoopDr. Roop Lal is presently working as Assistant Professor in the Mechanical Engineering Department, Delhi Technological University, Delhi. He has 17-years of experience in the aviation sector & over 20 years of teaching experi.

Condizione: New. PRINT ON DEMAND.

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Three-dimensional (3D) Integrated Circuits (ICs) has emerged as a new technology providing noticeable solutions to alleviate problems like greater power consumption, longer interconnects with large delays, etc. In 3D ICs, have multiple layers stacked one above the other. Vertical integration of multiple layers scales up the performance of electronic devices beyond Moore's law. It drastically decreases the interconnect length which directly results in increased speed and also combines various technologies (digital, analog, memory, etc.) in a single product, thereby greatly extending the capabilities of System-on-Chip. The objective of this book is to investigate the effects of core utilization on the core and chip area for obtaining the optimal sets of core utilization so that the core and chip area of the 3D ICs can be reduced. Cadence Encounter-to-GDSII has been used for optimization while performing physical designing of the 3D ICs. The literature survey has revealed that majority of the optimization has been performed only at any one of the stages of physical designing while in this book we have done research optimization at three different stages of physical designing.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 100 pp. Englisch.

Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Three-dimensional (3D) Integrated Circuits (ICs) has emerged as a new technology providing noticeable solutions to alleviate problems like greater power consumption, longer interconnects with large delays, etc. In 3D ICs, have multiple layers stacked one above the other. Vertical integration of multiple layers scales up the performance of electronic devices beyond Moore¿s law. It drastically decreases the interconnect length which directly results in increased speed and also combines various technologies (digital, analog, memory, etc.) in a single product, thereby greatly extending the capabilities of System-on-Chip. The objective of this book is to investigate the effects of core utilization on the core and chip area for obtaining the optimal sets of core utilization so that the core and chip area of the 3D ICs can be reduced. Cadence Encounter-to-GDSII has been used for optimization while performing physical designing of the 3D ICs. The literature survey has revealed that majority of the optimization has been performed only at any one of the stages of physical designing while in this book we have done research optimization at three different stages of physical designing.