9786202556989 - a transient study on heat dissipation problem in microelectronics: an overview of thermal management for next generation microelectronic devices di loganathan, arulmurugan; s, raghavendraprabhu; c, muthumohan (13 risultati)
A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
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Da: California Books, Miami, FL, U.S.A.California Books
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A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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Da: Chiron Media, Wallingford, Regno UnitoChiron Media
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A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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Altre immagini- Brossura
Da: preigu, Osnabrück, Germaniapreigu
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Taschenbuch. Condizione: Neu. A Transient Study on Heat Dissipation Problem in Microelectronics | An overview of thermal management for next generation microelectronic devices | Arulmurugan Loganathan (u. a.) | Taschenbuch | 52 S. | Englisch | 2020 | LAP LAMBERT Academic Publishing | EAN 9786202556989 | Verantwortliche Person fü…r die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.
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Da: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
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PAP. Condizione: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Da: PBShop.store UK, Fairford, GLOS, Regno UnitoPBShop.store UK
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PAP. Condizione: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermaniaBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The concern about thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat si…nks could improve thermal efficiency of the system. Challenges posed for the modeling of thermal phenomena in microelectronics from optimizing IC packaging thermal performance, assembly processes and reliability testing to predicting operational temperature in application environments. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics. 52 pp. Englisch.
A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
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- Print on Demand
Da: Majestic Books, Hounslow, Regno UnitoMajestic Books
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Condizione: New. Print on Demand.
A Transient Study on Heat Dissipation Problem in Microelectronics: An overview of thermal management for next generation microelectronic devices
Loganathan, Arulmurugan; S, Raghavendraprabhu; C, Muthumohan
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Da: Biblios, frankfurt am main, HESSE, GermaniaBiblios
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Condizione: New. PRINT ON DEMAND.
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Da: moluna, Greven, Germaniamoluna
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Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Loganathan ArulmuruganArulmurugan Loganathan is working as an Assistant Professor in the Department of Electronics and Communication Engineering, Bannari Amman Institute of Technology, Sathyamangalam,…Erode, Tamilnadu, India. His res.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The concern about thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat sinks…could improve thermal efficiency of the system. Challenges posed for the modeling of thermal phenomena in microelectronics from optimizing IC packaging thermal performance, assembly processes and reliability testing to predicting operational temperature in application environments. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 52 pp. Englisch.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 60,48 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The concern about thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat sinks c…ould improve thermal efficiency of the system. Challenges posed for the modeling of thermal phenomena in microelectronics from optimizing IC packaging thermal performance, assembly processes and reliability testing to predicting operational temperature in application environments. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics.
