9787040576368 - 集成电路先进封装工艺——cu-cu键合技术 (2 risultati)
- Rilegato
Da: liu xing, Nanjing, JS, Cinaliu xing
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 125,22
EUR 15,42 spedizioneSpedito da Cina a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: New. HardCover.Pub Date:2022-03-01 Pages:187 Language:Chinese Publisher:Higher Education Press Interconnect bonding in microelectronic packaging is a key and difficult link in the back-end manufacturing of integrated circuits (ICs). . which directly affects the physical properties of the integrated circuit… itself. such as electrical properties. optical properties and thermal properties. and largely determines the miniaturization. functionalization. reliability and production cost of IC products. H.
- Rilegato
Da: liu xing, Nanjing, JS, Cinaliu xing
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 125,22
EUR 15,42 spedizioneSpedito da Cina a U.S.A.Quantità: 3 disponibili
Hardcover. Condizione: New. HardCover.Pub Date:2022-03-01 Pages:187 Language:Chinese Publisher:Higher Education Press Interconnect bonding in microelectronic packaging is a key and difficult link in the back-end manufacturing of integrated circuits (ICs). . which directly affects the physical properties of the integrated circuit… itself. such as electrical properties. optical properties and thermal properties. and largely determines the miniaturization. functionalization. reliability and production cost of IC products. H.
