9787302211464 - 【正常发货量大优惠】2册集成电路先进封装材料+集成电路系统级封装集成电路先进封装材料及应用集成电路封装测试先进封装工艺mems封装与测试技术书 (1 risultati)
Lingua: Cinese
Editore: Tsinghua University Press Pub. Date :2010-09- 03 2000
- Brossura
Da: liu xing, Nanjing, JS, Cinaliu xing
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 55,20
EUR 15,84 spedizioneSpedito da Cina a U.S.A.Quantità: 3 disponibili
paperback. Condizione: New. Language:Chinese.Paperback. Publisher: Tsinghua University Press Pub. Date :2010-09-03. This book is the author combines his years of research and practice. in reference to similar materials at home and abroad on the basis of carefully compiled from the. This book combined with modern cmos process of…development. starting from the components. a detailed analysis of a variety of typical analog cmos integrated circuit operating principle and design of analog cmos integrated circuit research and.
