ISBN: 9798172479724 - 3d ic and 2.5d ic design: architecture, chiplets, tsvs, interposers, advanced packaging, thermal management, and design optimization (6 risultati)

Paperback. Condizione: new. Paperback. The idea for this book grew out of a simple observation: while through-silicon vias, silicon interposers, and chiplet-based design have moved from research curiosities to the technologies underpinning nearly every leading-edge AI accelerator, server processor, and premium mobile system-on-chip shipped today, no single text had brought together the full breadth of this subject - from the physics of via etching to the economics of chiplet partitioning to the standards governing die-to-die interfaces - in one coherent, classroom- and practice-ready volume. This book is my attempt to fill that gap.3D and 2.5D integration sit at an unusually rich intersection of disciplines. A practicing engineer in this field must be conversant with semiconductor process technology (to understand what a foundry or OSAT partner can actually manufacture), with circuit and physical design (to build a chiplet that will function correctly once assembled), with thermal and mechanical engineering (because heat and stress, not merely electrical signals, ultimately determine whether a stacked assembly survives its intended product lifetime), and increasingly with system architecture and even supply-chain economics (because the decision to partition a system into chiplets is as much a business decision as a technical one). I have tried, throughout this book, to give each of these dimensions its due, rather than treating 3D/2.5D integration as a narrowly circuit-level or narrowly process-level topic.The book is organized to be read either sequentially, as a complete course of study, or selectively, by readers seeking depth in a particular subtopic. Part I establishes motivation and foundational packaging concepts. Part II works through the core enabling interconnect technologies - TSVs, interposers, redistribution layers, bonding, and stacking architectures - in the order a design team would typically encounter them when planning a new 3D/2.5D product. Part III addresses chiplet-based system design and the commercial packaging platforms that realize it in production. Part IV, the longest section of the book, treats the cross-cutting engineering disciplines - power delivery, signal integrity, thermal management, test, EDA methodology, design optimization, and reliability - that determine whether a 3D/2.5D system actually works, not merely in simulation but in high-volume manufacturing and in the field. Part V closes with applications and a look toward emerging research directions.This book is intended for graduate students and advanced undergraduates in electrical engineering, computer engineering, and materials science; for practicing engineers moving into advanced packaging, physical design, or system architecture roles who need a structured introduction to this field; and for technical managers and program leads who need enough fluency across the full breadth of the subject to make informed partitioning, packaging, and technology-selection decisions. Each chapter is written to be self-contained enough to serve as a standalone reference, while cross-references throughout connect related material across chapters for readers working through the book sequentially.The field this book describes is evolving rapidly, and any snapshot of specific commercial platforms, standard revisions, or process capabilities will inevitably age faster than the underlying physical principles and design disciplines that govern them. I have tried, wherever possible, to emphasize those durable principles - the physics of TSV parasitics, the economics of yield-driven partitioning, the systems-level logic of thermal-electrical-power co-design - over specific numbers that will shift with the next process generation, while still grounding the discussion in concrete, representative figures that give the reader a genuine feel for the scales involved. This it Shipping may be from multiple locations in the US or from the UK, depending on stock availability. …

Paperback. Condizione: new. Paperback. The idea for this book grew out of a simple observation: while through-silicon vias, silicon interposers, and chiplet-based design have moved from research curiosities to the technologies underpinning nearly every leading-edge AI accelerator, server processor, and premium mobile system-on-chip shipped today, no single text had brought together the full breadth of this subject - from the physics of via etching to the economics of chiplet partitioning to the standards governing die-to-die interfaces - in one coherent, classroom- and practice-ready volume. This book is my attempt to fill that gap.3D and 2.5D integration sit at an unusually rich intersection of disciplines. A practicing engineer in this field must be conversant with semiconductor process technology (to understand what a foundry or OSAT partner can actually manufacture), with circuit and physical design (to build a chiplet that will function correctly once assembled), with thermal and mechanical engineering (because heat and stress, not merely electrical signals, ultimately determine whether a stacked assembly survives its intended product lifetime), and increasingly with system architecture and even supply-chain economics (because the decision to partition a system into chiplets is as much a business decision as a technical one). I have tried, throughout this book, to give each of these dimensions its due, rather than treating 3D/2.5D integration as a narrowly circuit-level or narrowly process-level topic.The book is organized to be read either sequentially, as a complete course of study, or selectively, by readers seeking depth in a particular subtopic. Part I establishes motivation and foundational packaging concepts. Part II works through the core enabling interconnect technologies - TSVs, interposers, redistribution layers, bonding, and stacking architectures - in the order a design team would typically encounter them when planning a new 3D/2.5D product. Part III addresses chiplet-based system design and the commercial packaging platforms that realize it in production. Part IV, the longest section of the book, treats the cross-cutting engineering disciplines - power delivery, signal integrity, thermal management, test, EDA methodology, design optimization, and reliability - that determine whether a 3D/2.5D system actually works, not merely in simulation but in high-volume manufacturing and in the field. Part V closes with applications and a look toward emerging research directions.This book is intended for graduate students and advanced undergraduates in electrical engineering, computer engineering, and materials science; for practicing engineers moving into advanced packaging, physical design, or system architecture roles who need a structured introduction to this field; and for technical managers and program leads who need enough fluency across the full breadth of the subject to make informed partitioning, packaging, and technology-selection decisions. Each chapter is written to be self-contained enough to serve as a standalone reference, while cross-references throughout connect related material across chapters for readers working through the book sequentially.The field this book describes is evolving rapidly, and any snapshot of specific commercial platforms, standard revisions, or process capabilities will inevitably age faster than the underlying physical principles and design disciplines that govern them. I have tried, wherever possible, to emphasize those durable principles - the physics of TSV parasitics, the economics of yield-driven partitioning, the systems-level logic of thermal-electrical-power co-design - over specific numbers that will shift with the next process generation, while still grounding the discussion in concrete, representative figures that give the reader a genuine feel for the scales invo Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability. …

Taschenbuch. Condizione: Neu. Neuware.

PAP. Condizione: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.

Condizione: New. Print on Demand.

PAP. Condizione: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.