Innovations signal processing embedded (19 risultati)

Lingua: Inglese
Editore: Springer, 2022
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Hardcover. Condizione: new. Hardcover. This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 2223, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

Lingua: Inglese
Editore: Springer, Berlin|Springer Nature Singapore|Springer, 2023
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Lingua: Inglese
Editore: Springer, Berlin|Springer Nature Singapore|Springer, 2022
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Lingua: Inglese
Editore: Springer, 2023
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Taschenbuch. Condizione: Neu. Innovations in Signal Processing and Embedded Systems | Proceedings of ICISPES 2021 | Jyotsna Kumar Mandal (u. a.) | Taschenbuch | Algorithms for Intelligent Systems | xiv | Englisch | 2023 | Springer | EAN 9789811916717 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.…

Lingua: Inglese
Editore: Springer, 2022
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Condizione: Hervorragend. Zustand: Hervorragend | Seiten: 512 | Sprache: Englisch | Produktart: Bücher | This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22¿23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS.…

Innovations in Signal Processing and Embedded Systems: Proceedings of Icispes 2021
Mandal, Jyotsna Kumar (Editor)/ Hinchey, Mike (Editor)/ Rao, K. Sreenivas (Editor)
Lingua: Inglese
Editore: Springer Nature, 2022
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Hardcover. Condizione: Brand New. 512 pages. 9.25x6.10x1.26 inches. In Stock.

Lingua: Inglese
Editore: Springer, 2023
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS.…

Lingua: Inglese
Editore: Springer, 2023
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paperback. Condizione: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Lingua: Inglese
Editore: Springer, 2022
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS.…

Lingua: Inglese
Editore: Springer, 2023
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Lingua: Inglese
Editore: Springer, 2022
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Lingua: Inglese
Editore: Springer Nature Singapore Sep 2023, 2023
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS. 512 pp. Englisch.…

Lingua: Inglese
Editore: Springer Nature Singapore Sep 2022, 2022
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Buch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book covers four sections such as artificial intelligence andmachine learning; VLSI and signal processing; robotics and automation; and communications and networking.This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM,SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer visioninnovations in robotics, reconfigurable robots, and MEMS/NEMS. 512 pp. Englisch.…

Lingua: Inglese
Editore: Springer, Springer Sep 2023, 2023
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 512 pp. Englisch.…

Lingua: Inglese
Editore: Springer, Springer Sep 2022, 2022
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Buch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book covers four sections such as artificial intelligence and machine learning; VLSI and signal processing; robotics and automation; and communications and networking. This book is a collection of selected papers presented at the First International Conference on Innovations in Signal Processing and Embedded Systems (ICISPES 2021), organized by MLR Institute of Technology, Hyderabad, India, during October 22-23, 2021. The topics covered are advanced communication technologies, IoT-based systems and applications, application AI in computer vision, natural language processing, reinforcement learning, ANN and deep neural networks, RNN, GAN, CNN and RBM, SOC, NOC design, VLSI and CAD/CAM, cross-layer design, fault tolerance and computation theories, FPGA in outer space, nanotechnology, semiconductor technology, signal and image processing, high-performance computing, pattern recognition and computer vision innovations in robotics, reconfigurable robots, and MEMS/NEMS.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 512 pp. Englisch.…

Lingua: Inglese
Editore: Springer, 2022
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