Integrated circuits semiconductor devices (62 risultati)

hardcover. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Hardcover. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Condizione: Good. No Jacket. Second Edition. Tan binding with dark red print on spine and cover. Cover also has a chip/transistor design on it. Light rubwear at tips and spine ends. Old price label on spine. Maroon endpapers. Sound and unmarked. 479 pages including index. Graphs and Charts (illustratore).…

Hardcover. Condizione: Good. Condizione sovraccoperta: no jacket present. The book is in good condition with a sturdy hardcover binding. The cover shows minor signs of wear, particularly at the edges and corners. There is no dust jacket. The pages are clean and free of inscriptions or library markings, maintaining the book's integrity for collectors and readers.…

hardcover. Condizione: Very Good. Clean Pages. Previous owners name inside. Proceeds benefit the Pima County Public Library system, which serves Tucson and southern Arizona. Slight edge wear and bumping.

Hardcover. Condizione: Good. Hardcover; surplus library copy with the usual stampings; reference number taped to spine; bar code taped to front cover; fading and shelf wear to ext erior; binding reinforced; in good condition with clean text.

Condizione: Very Good. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Hardcover. Condizione: Very Good. Hardcover, second edition; light fading, light shelf wear to exterior; in v ery good condition with clean text, firm binding.

Hardcover. Condizione: Near Fine. Hardback in near fine condition.

Condizione: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Hard Cover. Condizione: Very Good. No Jacket. First Edition. Hard Cover. Very Good/No Jacket. First Edition. 8vo - over 7¾" - 9¾" tall. beige cloth, 288pp, near-fine. Size: 8vo - over 7¾" - 9¾" tall.

Soft Cover. Condizione: Fine. No Jacket. First Edition. Soft Cover. Fine/No Jacket. First Edition. 8vo - over 7¾" - 9¾" tall. Published as Compel, Volume 11, No. 4, December 1992. Size: 8vo - over 7¾" - 9¾" tall.

Hard Cover. Condizione: Very Good. No Jacket. First Edition. Hard Cover. Very Good/No Jacket. First Edition. 8vo - over 7¾" - 9¾" tall. Signed by Author(s).

Hardcover. Condizione: UsedVeryGood. Hardcover, proceedings of the NASECODE II Conference held at Trinity Colleg e. Dublin, June 17-19, 1981. Light fading, light shelf wear to exterior; fo rmer owner's stamping on inside front board; otherwise in very good conditi on with clean text, firm binding.

Condizione: New.

Condizione: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In poor condition, suitable as a reading copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1150grams, ISBN:0070162212.…

Hardcover. Condizione: Very Good. Condizione sovraccoperta: Fair. 1st Edition. First Edition / First Print. Hardback copy in black boards with silver gilt lettering to spine. Price clipped dustjacket in new removable protective clear sleeve. 238pp. B/w diagrams throughout. Not library copy, no inscriptions, brown tape marks to dustjacket edges. (24/4).…

Staplebound. Condizione: Good. DTIC reprint. This was prepared for the Director, Defense Nuclear Agency under Contract NO. DNA 001-84-C-0196. It was approved for public release. DD Form 1473 lists the page count as 162. Illustrations. References. Cover has some wear. Some illustrations appear degraded from what would have appeared in the original publication. Results of a study of radiation effects on electronic materials, devices, and integrated circuits are presented in this report. Emphasis was placed on determining the underlying mechanisms responsible for observed radiation effects with a view toward gaining understanding of value in the development of radiation-hardened devices. Measurements and analyses were performed of the effects of single energetic neutrons and protons on silicon integrated circuits. This is a detailed description is given of the effects of radiation-induced displacement damage on device depletion regions. Single event upset studies included charge collection and transient current measurements on Si and GaAs devices following a single alpha-particle strike. The angular dependence of charge funneling was also investigated. The mechanisms of ionizing radiation effects on Si MOS devices were explored in detail using the thermally stimulated current technique and other measurement approaches. Data obtained by several techniques show that use of the radiation-induced shift of the capacitance-voltage curve at midgap is not generally valid for determining oxide trapped charge.…

Condizione: Fine. RUA11507446.

Condizione: Fine. RUA9500042.

Condizione: Fine. RUA10714498.

Condizione: New. Satisfaction Guaranteed or your money back.

Condizione: New. pp. 384.

paperback. Condizione: Good.

Condizione: As New. Unread book in perfect condition.

Condizione: As New. Unread book in perfect condition.

Condizione: New. pp. 350.

Condizione: New.

Condizione: New. &Uumlber den AutorChenming Calvin Hu holds the TSMC Distinguished Professor Chair of Microelectronics at University of California, Berkeley.&nbsp He is a member of the US Academy of Engineering and a foreign member .