EUR 72,94
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EUR 73,90
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Aggiungi al carrelloCondizione: New. pp. 290 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.
EUR 76,50
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Da: Basi6 International, Irving, TX, U.S.A.
EUR 98,25
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Aggiungi al carrelloCondizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
EUR 98,25
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Aggiungi al carrelloCondizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Da: Pistil Books Online, IOBA, Seattle, WA, U.S.A.
Membro dell'associazione: IOBA
EUR 95,91
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Aggiungi al carrelloHard Cover. Condizione: Fine. No Jacket. A clean, unmarked book with a tight binding. 278 pages.
Da: ALLBOOKS1, Direk, SA, Australia
EUR 108,11
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EUR 110,32
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Aggiungi al carrelloCondizione: New.
Da: Best Price, Torrance, CA, U.S.A.
EUR 104,76
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Aggiungi al carrelloCondizione: New. SUPER FAST SHIPPING.
Editore: Springer-Verlag New York Inc., New York, NY, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Lingua: Inglese
Da: Grand Eagle Retail, Mason, OH, U.S.A.
EUR 114,77
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Aggiungi al carrelloPaperback. Condizione: new. Paperback. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 111,29
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Da: Patrico Books, Apollo Beach, FL, U.S.A.
EUR 120,92
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Aggiungi al carrellohardcover. Condizione: As New. Ships Out Tomorrow!
EUR 131,14
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 127,81
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Aggiungi al carrelloCondizione: New. In.
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 139,71
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Aggiungi al carrelloCondizione: New. 2012. Paperback. . . . . .
EUR 153,77
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Da: Best Price, Torrance, CA, U.S.A.
EUR 148,22
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Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 156,71
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Aggiungi al carrelloCondizione: New.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 158,70
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Aggiungi al carrelloCondizione: New. In.
Editore: Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Lingua: Inglese
Da: Grand Eagle Retail, Mason, OH, U.S.A.
EUR 179,95
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Aggiungi al carrelloHardcover. Condizione: new. Hardcover. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
EUR 174,21
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Aggiungi al carrelloCondizione: New. 2012. Paperback. . . . . . Books ship from the US and Ireland.
EUR 183,86
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Editore: Springer US, Springer New York, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Lingua: Inglese
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 120,54
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
EUR 90,47
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Aggiungi al carrelloCondizione: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher.
EUR 166,62
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Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.
Editore: Springer-Verlag New York Inc., New York, NY, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Lingua: Inglese
Da: AussieBookSeller, Truganina, VIC, Australia
EUR 204,85
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Aggiungi al carrelloPaperback. Condizione: new. Paperback. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Editore: Springer-Verlag New York Inc., 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Lingua: Inglese
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Irlanda
EUR 226,71
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Aggiungi al carrelloCondizione: New. 3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. Editor(s): Sheibanyrad, Abbas; Petrot, Frederic; Jantsch, Axel. Series: Integrated Circuits and Systems. Num Pages: 278 pages, biography. BIC Classification: TJFC; UMZ. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 17. Weight in Grams: 584. . 2010. Hardback. . . . .
Editore: Springer-Verlag New York Inc., 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Lingua: Inglese
Da: Kennys Bookstore, Olney, MD, U.S.A.
EUR 282,99
Convertire valutaQuantità: 15 disponibili
Aggiungi al carrelloCondizione: New. 3D-Integration for NoC-based SoC Architectures gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. Editor(s): Sheibanyrad, Abbas; Petrot, Frederic; Jantsch, Axel. Series: Integrated Circuits and Systems. Num Pages: 278 pages, biography. BIC Classification: TJFC; UMZ. Category: (P) Professional & Vocational. Dimension: 229 x 152 x 17. Weight in Grams: 584. . 2010. Hardback. . . . . Books ship from the US and Ireland.
Editore: Springer-Verlag New York Inc., New York, NY, 2010
ISBN 10: 1441976175 ISBN 13: 9781441976178
Lingua: Inglese
Da: AussieBookSeller, Truganina, VIC, Australia
EUR 301,20
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Aggiungi al carrelloHardcover. Condizione: new. Hardcover. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
Editore: Springer New York Dez 2012, 2012
ISBN 10: 1461427487 ISBN 13: 9781461427483
Lingua: Inglese
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 117,69
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field. 288 pp. Englisch.