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Editore: Berlin : Springer,, 2009
ISBN 10: 0387782184ISBN 13: 9780387782188
Da: Versandantiquariat buch-im-speicher, Berlin, Germania
Membro dell'associazione: GIAQ
Libro
Condizione: Gut. 719 S. : Mit Abb., graph. Darst.; Sehr sauber und ohne Lesespuren / Very good condition, maybe unread book. Sprache: Englisch Gewicht in Gramm: 1193 24 cm, roter Org.-Pappb. / red hardcover.
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Nuovo - A partire da EUR 105,06
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Editore: New York, Institute of Electrical and Electronics Engineers, 1997
Da: Antiquariat Bookfarm, Löbnitz, Germania
Libro
183 S. ehem. Bibliotheksexemplar mit Kleberesten auf Einband und Stempel innen, guter Zustand. Sprache: Englisch Gewicht in Gramm: 550.
Editore: CRC Press, 2023
ISBN 10: 0367556006ISBN 13: 9780367556006
Da: GreatBookPrices, Columbia, MD, U.S.A.
Libro
Condizione: New.
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Editore: Springer Nature Singapore, 2018
ISBN 10: 9811319081ISBN 13: 9789811319082
Da: Buchpark, Trebbin, Germania
Libro
Condizione: Hervorragend. Zustand: Hervorragend | Seiten: 316 | Sprache: Englisch.
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Editore: Syrawood Publishing House, 2023
ISBN 10: 1647403707ISBN 13: 9781647403706
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
Libro
Condizione: New. Brand New Original US Edition.We Ship to PO BOX Address also. EXPEDITED shipping option also available for faster delivery.This item may ship from the US or other locations in India depending on your location and availability.
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Nuovo - A partire da EUR 96,51
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Editore: CRC Press, 2020
ISBN 10: 0367335387ISBN 13: 9780367335380
Da: Basi6 International, Irving, TX, U.S.A.
Libro
Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Editore: World Scientific Publishing Company, 2018
ISBN 10: 9813237600ISBN 13: 9789813237605
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
Libro
Condizione: New.
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Editore: Taylor & Francis, 2021
Da: Books in my Basket, New Delhi, India
Libro
Hardcover. Condizione: New. ISBN:9780367335380.
Editore: National Defence Industry Press, 2016
ISBN 10: 7118100617ISBN 13: 9787118100617
Da: liu xing, Nanjing JiangSu, JS, Cina
Libro
paperback. Condizione: New. Language:Chinese.Advanced materials for thermal management of electronic packaging.
Editore: Lala Maurizio, 2018
ISBN 10: 012812640XISBN 13: 9780128126400
Da: Brook Bookstore On Demand, Napoli, NA, Italia
Libro Print on Demand
Condizione: new. Questo è un articolo print on demand.
Editore: Springer, 2013
ISBN 10: 1461427924ISBN 13: 9781461427926
Da: Ria Christie Collections, Uxbridge, Regno Unito
Libro Print on Demand
Condizione: New. PRINT ON DEMAND Book; New; Fast Shipping from the UK. No. book.
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Editore: Springer, 2018
ISBN 10: 3319832093ISBN 13: 9783319832098
Da: booksXpress, Bayonne, NJ, U.S.A.
Libro
Soft Cover. Condizione: new.
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Editore: Springer, 2016
ISBN 10: 3319450972ISBN 13: 9783319450971
Da: Books Puddle, New York, NY, U.S.A.
Libro
Condizione: New.
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Editore: Springer Singapore, 2015
ISBN 10: 9811000700ISBN 13: 9789811000706
Da: moluna, Greven, Germania
Libro Print on Demand
Gebunden. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Includes over 130 peer-reviewed papers from professional researchers Covers a wide range of topics including, but not limited to, image science, materials science and digital media Presents the latest scientific achievements and current t.
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Editore: Springer Singapore, 2019
ISBN 10: 9811090785ISBN 13: 9789811090783
Da: moluna, Greven, Germania
Libro Print on Demand
Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Includes over 130 peer-reviewed papers from professional researchers Covers a wide range of topics including, but not limited to, image science, materials science and digital media Presents the latest scientific achievements and current t.
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Editore: Springer, 2011
ISBN 10: 1441977589ISBN 13: 9781441977588
Da: booksXpress, Bayonne, NJ, U.S.A.
Libro
Hardcover. Condizione: new.
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Editore: ???????, 2020
ISBN 10: 712233497XISBN 13: 9787122334978
Da: liu xing, Nanjing JiangSu, JS, Cina
Libro
Hardcover. Condizione: New. HardCover. Pub Date: 2020-04-01 Pages: 355 Language: English Publisher: Chemical Industry Press Freeform optics is a new LED lighting optics technology. its advantage lies in the high degree of design freedom and accurate light energy distribution Control can provide an effective optical design method to achieve high-quality LED lighting.?This book systematically introduces a series of free-form optical algorithms and design methods for LED packaging and applications. including various circul.
Editore: Chemical Industry Press, 2021
ISBN 10: 7122394484ISBN 13: 9787122394484
Da: liu xing, Nanjing JiangSu, JS, Cina
Libro
Hardcover. Condizione: New. HardCover.Pub Date:2021-12-01 Pages:247 Language:English Publisher:Chemical Industry PressThe main advantages of solid-state lighting are energy saving. environmental friendliness and long life. and LED (Light Emitting Diode) packaging is the main guarantee for obtaining these advantages technology. This book not only covers the basic principles of lighting. colorimetry. photometry. light-emitting diodes. but also provides a comprehensive introduction to LED wafer and chip manufacturing. LED .
Editore: Chemical Industry Press, 2021
ISBN 10: 7122394840ISBN 13: 9787122394842
Da: liu xing, Nanjing JiangSu, JS, Cina
Libro
Hardcover. Condizione: New. HardCover.Pub Date:2021-12-01 Pages:273 Language:English Publisher:Chemical Industry Press 3D RF integration application is an important application development direction of through silicon via (TSV) 3D integration technology. With the rise of 5G and millimeter-wave applications. thin-film bulk acoustic resonator (FBAR) devices based on high-resistance silicon TSV wafer-level packaging. and radio frequency microelectromechanical system (RF MEMS) switching devices have gradually achieved comme.
Editore: Trans Tech Pubn, 2008
ISBN 10: 0878493832ISBN 13: 9780878493838
Da: dsmbooks, Liverpool, Regno Unito
Libro
Paperback. Condizione: Like New. Like New. book.
Editore: Chemical Industry Press, 2021
ISBN 10: 7122392279ISBN 13: 9787122392275
Da: liu xing, Nanjing JiangSu, JS, Cina
Libro
Hardcover. Condizione: New. HardCover.Pub Date:2021-12-01 Pages:696 Language:English Publisher:Chemical Industry Press With the development of electronic packaging. electronic packaging has changed from the traditional four main functions (power system. signal distribution and transmission. heat dissipation and Mechanical protection) is expanded to six functions. namely. two new functions. DFX and system test. are added. Where DFX is designed for X. X includes: manufacturability. reliability. maintainability. cost. and .