Da: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germania
EUR 12,00
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloIX, 218 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Online access with purchase: Springer. Sprache: Englisch.
Condizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
EUR 84,39
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: Books Puddle, New York, NY, U.S.A.
EUR 92,69
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. 230.
EUR 89,99
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: Majestic Books, Hounslow, Regno Unito
EUR 95,17
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. 230.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 98,25
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. 230.
Editore: Springer New York, Springer US Okt 2016, 2016
ISBN 10: 1493947109 ISBN 13: 9781493947102
Lingua: Inglese
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 99,98
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Neuware -This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as ¿More than Moore¿ (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to ¿Moore's Law¿. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 228 pp. Englisch.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 101,89
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Editore: Springer New York, Springer US, 2016
ISBN 10: 1493947109 ISBN 13: 9781493947102
Lingua: Inglese
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 103,00
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as 'More than Moore' (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to 'Moore's Law'. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
Da: Best Price, Torrance, CA, U.S.A.
EUR 96,32
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloCondizione: New. SUPER FAST SHIPPING.
Editore: Springer New York, Springer New York Feb 2015, 2015
ISBN 10: 1493921622 ISBN 13: 9781493921621
Lingua: Inglese
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 106,99
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Neuware -This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as ¿More than Moore¿ (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to ¿Moore's Law¿. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 228 pp. Englisch.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 116,28
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 112,51
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Editore: Springer New York, Springer New York, 2015
ISBN 10: 1493921622 ISBN 13: 9781493921621
Lingua: Inglese
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 111,53
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as 'More than Moore' (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to 'Moore's Law'. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 121,19
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 127,41
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Books Puddle, New York, NY, U.S.A.
EUR 142,71
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. pp. 227.
Da: Revaluation Books, Exeter, Regno Unito
EUR 150,69
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. reprint edition. 227 pages. 9.25x6.00x0.75 inches. In Stock.
Da: Revaluation Books, Exeter, Regno Unito
EUR 151,94
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloHardcover. Condizione: Brand New. 218 pages. 9.25x6.25x0.75 inches. In Stock.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 102,48
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 171,53
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Editore: Springer New York Okt 2016, 2016
ISBN 10: 1493947109 ISBN 13: 9781493947102
Lingua: Inglese
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 99,98
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as 'More than Moore' (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to 'Moore's Law'. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect. 228 pp. Englisch.
Editore: Springer New York Feb 2015, 2015
ISBN 10: 1493921622 ISBN 13: 9781493921621
Lingua: Inglese
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 106,99
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book provides a comprehensive overview of key technologies being used to address challenges raised by continued device scaling and the extending gap between memory and central processing unit performance. Authors discuss in detail what are known commonly as 'More than Moore' (MtM), technologies, which add value to devices by incorporating functionalities that do not necessarily scale according to 'Moore's Law'. Coverage focuses on three key technologies needed for efficient power management and cost per performance: novel memories, 3D integration and photonic on-chip interconnect. 228 pp. Englisch.
Editore: Springer-Verlag New York Inc., 2015
ISBN 10: 1493921622 ISBN 13: 9781493921621
Lingua: Inglese
Da: THE SAINT BOOKSTORE, Southport, Regno Unito
EUR 136,59
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloHardback. Condizione: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 606.
Da: Majestic Books, Hounslow, Regno Unito
EUR 148,75
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 227.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 152,86
Convertire valutaQuantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 227.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 86,24
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.