Optoelectronic packaging (18 risultati)

Hardback. Condizione: Good. This title presents both the foundational theory of optoelectronic packaging and the many practical applications. Topics covered include component level packaging, guided wave interconnects, free space interconnects, and displays.

Hardback. Condizione: Good. This title presents both the foundational theory of optoelectronic packaging and the many practical applications. Topics covered include component level packaging, guided wave interconnects, free space interconnects, and displays.

Condizione: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

Condizione: sehr gut. 313 S., Abb., 21 cm. Sprache: Deutsch.

Hardcover. Condizione: Gut. Ehem. Bibliotheksexemplar mit Bib.-Signatur und Stempel in GUTEM Zustand. Kaum Gebrauchsspuren. Sprache: Englisch Gewicht in Gramm: 550.

Condizione: Fine. 471 pp., hardcover, THIS IS A BRAND NEW, NEVER-OPENED BOOK!! - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country. Photos available upon request.…

Condizione: New. pp. 280.

Hardcover. Condizione: New.

paperback. Condizione: New. Paperback. Pub Date: 2011 Jun Pages: 95 Publisher: Electronic Industry Press semiconductor optoelectronic device packaging process (with DVD disc 1) for the entire semiconductor optoelectronic device package with the conditions and process are described. including: optoelectronic devices package specification. the process of expanding crystal mounted process. the lead welding process. device packaging technology. testing and packaging of the product six projects are done on semiconductor opto. …

paperback. Condizione: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2013-08-01 Pages: 216 Language: Chinese Publisher: Huazhong University of Science and Technology Publishing House LED packaging technology base and job tasks to resolve technical and vocational education . second five curriculum reform planning materials Optoelectronic Technology ( Information ) class contains two parts: the first part introduces the basic concepts of the various aspects of LED industry chain and basic knowledge of the specific content including the LED s.Four Satisfaction guaranteed,or money back.…

Hardcover. Condizione: New. Hardcover Pages Number: 433 Language: Chinese. Semiconductor Science and Technology Series: Optoelectronic devices microwave packaging and testing (2nd Edition) summary of years of work experience and recent research results. the system introduces high-speed optoelectronic devices test a total of 12 chapters. and practical techniques for microwave packaging design. advanced. academic and practical both the book and includes a semiconductor laser light modulation device and a photodetector thr.…

paperback. Condizione: New. Language:Chinese.Paperback. Publisher: Science out.

Condizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condizione: New.

Condizione: New.

Condizione: New.

Condizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condizione: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.