Da: GreatBookPrices, Columbia, MD, U.S.A.
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Da: Lucky's Textbooks, Dallas, TX, U.S.A.
Condizione: New.
Da: Ria Christie Collections, Uxbridge, Regno Unito
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Editore: VDM Verlag Dr. M�ller 2008-12-03, 2008
ISBN 10: 363903564X ISBN 13: 9783639035643
Lingua: Inglese
Da: Chiron Media, Wallingford, Regno Unito
EUR 71,09
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Da: GreatBookPricesUK, Woodford Green, Regno Unito
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Da: preigu, Osnabrück, Germania
EUR 66,45
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Sensor-based Modeling and Monitoring of Chemical Mechanical Polishing | Analysis of Experimental Sensor Data Integrating Statistical Time Series Analysis and Nonlinear Dynamics (Chaos Theory) Paradigms | Prahalada Rao | Taschenbuch | Kartoniert | Englisch | 2008 | VDM Verlag Dr. Müller | EAN 9783639035643 | Verantwortliche Person für die EU: OmniScriptum GmbH & Co. KG, Bahnhofstr. 28, 66111 Saarbrücken, info[at]akademikerverlag[dot]de | Anbieter: preigu.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 158,16
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 148,80
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Da: GreatBookPrices, Columbia, MD, U.S.A.
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Da: moluna, Greven, Germania
EUR 71,14
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Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book provides a framework for real time controlof the Chemical Mechanical Planarization (CMP)process based on combining nonlinear dynamicsprinciples with statistical process monitoringapproaches. CMP has a directbearing on.
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 80,77
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This book provides a framework for real time controlof the Chemical Mechanical Planarization (CMP)process based on combining nonlinear dynamicsprinciples with statistical process monitoringapproaches. CMP has a directbearing on the computational speed and dimensionalcharacteristics of solid state devices. The challengein CMP may be narrowed to domains envelopingproductivity, measured in terms of material removalrate (MRR), and quality which is usually specified interms of surface roughness - Ra, within wafernon-uniformity (WIWNU), defect rate, etc. In thiswork, experimental investigations of CMP are executedwith the aid of sensors. The analysis of the datareveals the presence of pronounced stochastic-dynamiccharacteristics. As a result, we derive a processcontrol method integrating statistical time seriesanalysis and nonlinear dynamics which captures ~ 80%(linear R-sq) of the variation in MRR. In this mannera novel paradigm for effective process control in CMPhas been presented.