Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
EUR 42,20
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Da: Basi6 International, Irving, TX, U.S.A.
EUR 42,20
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Aggiungi al carrelloCondizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Editore: Springer
ISBN 10: 8120090004 ISBN 13: 9788120090002
Da: Books in my Basket, New Delhi, India
EUR 15,61
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Aggiungi al carrelloHardcover. Condizione: New. ISBN: 9783211728604.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
EUR 42,27
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EUR 42,27
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Aggiungi al carrelloCondizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Buchpark, Trebbin, Germania
Condizione: Sehr gut. Zustand: Sehr gut | Seiten: 480 | Sprache: Englisch | Produktart: Bücher.
Da: Buchpark, Trebbin, Germania
Condizione: Sehr gut. Zustand: Sehr gut | Seiten: 480 | Sprache: Englisch | Produktart: Bücher.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
EUR 66,65
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Aggiungi al carrelloCondizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Da: Basi6 International, Irving, TX, U.S.A.
EUR 66,65
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Aggiungi al carrelloCondizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.
EUR 113,47
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Aggiungi al carrelloCondizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
EUR 113,47
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Aggiungi al carrelloCondizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 168,14
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Aggiungi al carrelloCondizione: New. In.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 168,14
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Aggiungi al carrelloCondizione: New. In.
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 160,49
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The 'Twelfth International Conference on Simulation of Semiconductor Processes and Devices' (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites.
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 160,49
Convertire valutaQuantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The 'Twelfth International Conference on Simulation of Semiconductor Processes and Devices' (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites.
Editore: Springer Vienna, Springer Vienna Sep 2007, 2007
ISBN 10: 3211728600 ISBN 13: 9783211728604
Lingua: Inglese
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 160,49
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Aggiungi al carrelloBuch. Condizione: Neu. Neuware -The 'Twelfth International Conference on Simulation of Semiconductor Processes and Devices' (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites. 480 pp. Englisch.
Editore: Springer Vienna, Springer Vienna Apr 2017, 2017
ISBN 10: 3709119111 ISBN 13: 9783709119112
Lingua: Inglese
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 160,49
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Neuware -The 'Twelfth International Conference on Simulation of Semiconductor Processes and Devices' (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 480 pp. Englisch.
Da: California Books, Miami, FL, U.S.A.
EUR 179,17
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Da: Books Puddle, New York, NY, U.S.A.
EUR 200,56
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Aggiungi al carrelloCondizione: New. pp. 480.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 158,75
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Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 159,00
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Da: Revaluation Books, Exeter, Regno Unito
EUR 236,67
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Aggiungi al carrelloPaperback. Condizione: Brand New. reprint edition. 480 pages. 9.25x6.10x1.09 inches. In Stock.
Da: Revaluation Books, Exeter, Regno Unito
EUR 239,41
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Aggiungi al carrelloHardcover. Condizione: Brand New. hardback/cd-rom edition. 458 pages. 9.25x6.25x0.75 inches. In Stock.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 230,66
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Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Da: UK BOOKS STORE, London, LONDO, Regno Unito
EUR 268,37
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Aggiungi al carrelloHardcover. Condizione: NEW. Brand New! Fast Delivery USA Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 7-14 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
EUR 268,28
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Aggiungi al carrelloHardcover. Condizione: Brand New. Brand New! Fast Delivery, Delivery With In 8-14 working Day Only , USA Edition Original Edition. Excellent Quality, Printing In English Language, Quick delivery by FEDEX & DHL. USPS & UPS Act. Our courier service is not available at PO BOX& APO BOX. Ship from India & United States.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 254,82
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Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.
Editore: Springer, 2007
Da: Books in my Basket, New Delhi, India
EUR 176,46
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Aggiungi al carrelloHardcover. Condizione: New. ISBN:9783211728604.
Da: moluna, Greven, Germania
EUR 136,16
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Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent .
Da: moluna, Greven, Germania
EUR 136,16
Convertire valutaQuantità: Più di 20 disponibili
Aggiungi al carrelloBundle. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent .