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This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance.
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Simulation of Semiconductor Processes and Devices 2007 (eng)
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Simulation of Semiconductor Processes and Devices 2007
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Springer Vienna Apr 2017, 2017
ISBN 10: 3709119111
ISBN 13: 9783709119112
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent advances and developments in the theoretical description, physical modeling and numerical simulation and analysis of semiconductor fabrication processes, device operation and system performance. 480 pp. Englisch. Codice articolo 9783709119112
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Simulation of Semiconductor Processes and Devices 2007
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Springer Vienna, 2017
ISBN 10: 3709119111
ISBN 13: 9783709119112
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Kartoniert / Broschiert. Condizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This volume contains the proceedings of the 12th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2007, held September 2007 in Vienna, Austria. It provides a global forum for the presentation and discussion of recent . Codice articolo 449334530
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Simulation of Semiconductor Processes and Devices 2007 : Sispad 2007
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Simulation of Semiconductor Processes and Devices 2007: SISPAD 2007
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Simulation of Semiconductor Processes and Devices 2007 : SISPAD 2007
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - The 'Twelfth International Conference on Simulation of Semiconductor Processes and Devices' (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites. Codice articolo 9783709119112
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Simulation of Semiconductor Processes and Devices 2007
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Springer, Springer Apr 2017, 2017
ISBN 10: 3709119111
ISBN 13: 9783709119112
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The 'Twelfth International Conference on Simulation of Semiconductor Processes and Devices' (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presenta tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad spec trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 480 pp. Englisch. Codice articolo 9783709119112
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Simulation of Semiconductor Processes and Devices 2007: SISPAD 2007
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Condizione: New. pp. 480 Softcover reprint of the original 1st ed. 2007 edition NO-PA16APR2015-KAP. Codice articolo 26378369692
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Simulation of Semiconductor Processes and Devices 2007: SISPAD 2007
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Condizione: New. Print on Demand pp. 480. Codice articolo 385534275
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Simulation of Semiconductor Processes and Devices 2007: SISPAD 2007
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Condizione: New. PRINT ON DEMAND pp. 480. Codice articolo 18378369686
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