Da: Anybook.com, Lincoln, Regno Unito
EUR 2,98
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,600grams, ISBN:9780412617300.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 60,02
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. pp. 324.
Da: Revaluation Books, Exeter, Regno Unito
EUR 79,88
Quantità: 2 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 324 pages. 9.61x6.69x0.68 inches. In Stock.
EUR 48,37
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 53,49
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
Da: preigu, Osnabrück, Germania
EUR 50,35
Quantità: 5 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Technology CAD Systems | Franz Fasching (u. a.) | Taschenbuch | viii | Englisch | 2012 | Springer | EAN 9783709193174 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 110,70
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 166,64
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Very Good. Dust Jacket may NOT BE INCLUDED.CDs may be missing. SHIPS FROM MULTIPLE LOCATIONS. book.
Lingua: Inglese
Editore: New York, NY, U.S.A.: Chapman & Hall, 1995, 1994
ISBN 10: 0412617307 ISBN 13: 9780412617300
Da: White Raven Books, Ypsilanti, MI, U.S.A.
Hardcover. Condizione: Near Fine. 6"x9.5". Shiny yellow paper over boards; an almost fine ex library copy with no dust jacket; "This book presents a state-of-the-art review of feature techniques in CAD/CAM.The key feature modelling issues addressed are: organization, management, representation, recognition, and validation.".
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 235,95
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 223,29
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 223,28
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: GreatBookPrices, Columbia, MD, U.S.A.
EUR 241,21
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New.
Da: GreatBookPricesUK, Woodford Green, Regno Unito
EUR 242,91
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 294,27
Quantità: 1 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Neuware - This book provides up-to-date information about the promising use of feature technology for integrating computer-aided-design with subsequent applications. The book consists of 20 articles based upon the international IFIP conference on this topic held in Valenciennes, France in May 1994.
Da: Celler Versandantiquariat, Eicklingen, Germania
Membro dell'associazione: GIAQ
EUR 27,00
Quantità: 1 disponibili
Aggiungi al carrelloSpringer, Wien, 1993. VIII, 309 pages with 199 figures, hard cover, (former library book)--- 736 Gramm.
Lingua: Cinese
Editore: Northwestern Polytechnical University Press, 2000
ISBN 10: 7561230699 ISBN 13: 9787561230695
Da: liu xing, Nanjing, JS, Cina
EUR 65,27
Quantità: 1 disponibili
Aggiungi al carrellopaperback. Condizione: New. Paperback. Pub Date: 2011 Pages: 337 Language: Chinese in Publisher: Northwestern Polytechnical University Press colleges 12th Five-Year Plan textbook Mechanical Manufacturing and Automation Series: CAD facing the entire product lifecycle theory and technology system from the point of view for the entire life cycle of products. a combination of theory and practice. the system is a thorough introduction to the basic concepts of a CAD development history. theory. techniques. methods. systems. a.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 46,22
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Da: Majestic Books, Hounslow, Regno Unito
EUR 71,80
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand pp. 324 199 Figures, 67:B&W 6.69 x 9.61 in or 244 x 170 mm (Pinched Crown) Perfect Bound on White w/Gloss Lam.
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 53,49
Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools. 324 pp. Englisch.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 72,88
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND pp. 324.
Lingua: Inglese
Editore: Springer Vienna, Springer Jan 2012, 2012
ISBN 10: 3709193176 ISBN 13: 9783709193174
Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germania
EUR 53,49
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 324 pp. Englisch.