Da: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germania
Prima edizione
EUR 16,00
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Aggiungi al carrello1st ed. 19 x 24 cm. 336 pages. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
EUR 52,82
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Aggiungi al carrelloCondizione: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
EUR 52,84
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Aggiungi al carrelloCondizione: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Da: ALLBOOKS1, Direk, SA, Australia
EUR 58,75
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EUR 66,75
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Aggiungi al carrelloCondizione: New. pp. xv + 309.
EUR 66,36
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Aggiungi al carrelloCondizione: New. pp. xv + 309 Illus.
EUR 79,17
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Aggiungi al carrelloPaperback. Condizione: Brand New. 1st edition. 336 pages. 9.25x7.50x1.00 inches. In Stock.
Da: Nilbog Books, Portland, ME, U.S.A.
Prima edizione
EUR 57,10
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Aggiungi al carrelloHardcover. Condizione: New. Condizione sovraccoperta: None Issued. 1st Edition. This is a New and Unread copy of the first edition. No dust jacket issued in the first edition. An overview of the field of 3D IC Design with an emphasis on EDA tools and algorithms. Indexed.
Editore: Elsevier Science & Technology, 2008
ISBN 10: 0123743435 ISBN 13: 9780123743435
Lingua: Inglese
Da: THE SAINT BOOKSTORE, Southport, Regno Unito
EUR 88,90
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Aggiungi al carrelloPaperback / softback. Condizione: New. New copy - Usually dispatched within 4 working days. 869.
EUR 93,17
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Aggiungi al carrelloCondizione: New. pp. 496.
EUR 94,67
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Aggiungi al carrelloCondizione: New. pp. xv + 309.
EUR 94,16
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Aggiungi al carrelloPaperback. Condizione: Brand New. 2nd edition. 718 pages. 9.00x7.25x2.00 inches. In Stock.
Da: Buchpark, Trebbin, Germania
Condizione: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
EUR 113,65
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Aggiungi al carrelloCondizione: New. pp. 496.
EUR 114,33
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Aggiungi al carrelloCondizione: New. pp. 496.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 128,23
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Aggiungi al carrelloCondizione: New. In.
Da: Best Price, Torrance, CA, U.S.A.
EUR 148,44
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Aggiungi al carrelloCondizione: New. SUPER FAST SHIPPING.
Da: Best Price, Torrance, CA, U.S.A.
EUR 148,44
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Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 165,28
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Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 164,49
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore's law. This observation stated that transistor density in integrated circuits doubles every 1. 5-2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore's law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 166,62
Convertire valutaQuantità: 2 disponibili
Aggiungi al carrelloBuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore's law. This observation stated that transistor density in integrated circuits doubles every 1. 5-2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore's law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
EUR 208,50
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Aggiungi al carrelloCondizione: New. pp. 298.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 156,94
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Aggiungi al carrelloCondizione: New.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 193,50
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Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.
Da: Lucky's Textbooks, Dallas, TX, U.S.A.
EUR 157,34
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Da: UK BOOKS STORE, London, LONDO, Regno Unito
EUR 225,53
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Aggiungi al carrelloCondizione: Brand New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 7-11 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if the Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
Da: Revaluation Books, Exeter, Regno Unito
EUR 232,18
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Aggiungi al carrelloPaperback. Condizione: Brand New. 296 pages. 9.25x6.10x0.67 inches. In Stock.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 226,74
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Aggiungi al carrelloPaperback. Condizione: Like New. Like New. book.
Da: Brook Bookstore On Demand, Napoli, NA, Italia
EUR 70,21
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Aggiungi al carrelloCondizione: new. Questo è un articolo print on demand.
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 94,60
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Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -With vastly increased complexity and functionality in the 'nanometer era' (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future.This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits.Demonstrates how to overcome 'interconnect bottleneck' with 3-D integrated circuit design.leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designersThe FIRST book on 3-D integrated circuit design.provides up-to-date information that is otherwise difficult to findFocuses on design issues key to the product development cycle.good design plays a major role in exploiting the implementation flexibilities offered in the 3-DProvides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization.offers practical view of designing 3-D circuits 336 pp. Englisch.