Wafer scale integration (37 risultati)
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Da: Crossroad Books, Eau Claire, WI, U.S.A.Crossroad Books
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Hardcover. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Slight spine twist. Pages clean, but for library markings. ; TEH22A; 274 pages; Ex-Library.
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Da: Anybook.com, Lincoln, Regno UnitoAnybook.com
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Condizione: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,700grams, ISBN:0852744978.
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Da: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.Zubal-Books, Since 1961
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EUR 50,96
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Condizione: Good. *Price HAS BEEN REDUCED by 10% until Monday, June 15 (SALE item)* 402 pp., hardcover, ex library, else text clean & binding tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional dutie…s, taxes, or fees required by recipient's country.
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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EUR 175,47
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hardcover. Condizione: Good. Good. Dust Jacket NOT present. CD WILL BE MISSING. . SHIPS FROM MULTIPLE LOCATIONS. book.
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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EUR 225,65
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Condizione: New. In.
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Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
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EUR 225,65
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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EUR 225,64
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condizione: New.
Altre immagini- Brossura
Da: preigu, Osnabrück, Germaniapreigu
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EUR 186,70
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Taschenbuch. Condizione: Neu. Wafer Scale Integration | Earl E. Swartzlander Jr. | Taschenbuch | xx | Englisch | 2012 | Springer | EAN 9781461288961 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 276,67
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Condizione: New. pp. 528.
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Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
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EUR 260,97
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Condizione: New. Editor(s): Swartzlander, Earl E. Num Pages: 503 pages, black & white illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 28. Weight in Grams: 912. . 1989. Hardback. . . . .
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Da: Books Puddle, New York, NY, U.S.A.Books Puddle
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EUR 278,79
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Condizione: New. pp. 528.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 223,11
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Taschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good di…ce. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 225,03
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Buch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In…contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
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Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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EUR 327,18
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Condizione: New. Editor(s): Swartzlander, Earl E. Num Pages: 503 pages, black & white illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 28. Weight in Grams: 912. . 1989. Hardback. . . . . Books ship from the US and Ireland.
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Da: GreatBookPricesUK, Woodford Green, Regno UnitoGreatBookPricesUK
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EUR 328,24
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Condizione: As New. Unread book in perfect condition.
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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EUR 318,71
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Paperback. Condizione: Like New. Like New. book.
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Da: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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EUR 354,59
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Condizione: As New. Unread book in perfect condition.
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
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EUR 343,77
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Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Da: Celler Versandantiquariat, Eicklingen, , GermaniaCeller Versandantiquariat
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EUR 17,00
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Hilger, Bristol, 1986. XII, 274 pages with some graphics, hardcover in dust jacket----former library book in good condition/ Proceedings of a Workshop held in Southampton from 10 july to 12 july 1985- 618 Gramm.
Editore: Der Andere Verlag 2014
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Da: Buchpark, Trebbin, , GermaniaBuchpark
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EUR 122,57
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Condizione: Sehr gut. Zustand: Sehr gut | Produktart: Bücher | Keine Beschreibung verfügbar.
Da: Martinton Book Company, martinton, IL, U.S.A.Martinton Book Company
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IEEE l99l 340pp. (ISBN 0-8l86-9126-3).
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, , GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 34,00
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-scale integration, WSI for short, is a yet-unused system of building very-large integrated circui…t networks that use an entire silicon wafer to produce a single 'super-chip'. Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably massively parallel supercomputers. The name is taken from the term very-large-scale integration, the current state of the art when WSI was being developed. 80 pp. Englisch.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
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EUR 35,89
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Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-scale integration, WSI for short, is a yet-unused system of building very-large integrated circuit net…works that use an entire silicon wafer to produce a single 'super-chip'. Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably massively parallel supercomputers. The name is taken from the term very-large-scale integration, the current state of the art when WSI was being developed.
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Da: Brook Bookstore On Demand, Napoli, NA, ItaliaBrook Bookstore On Demand
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EUR 166,29
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Condizione: new. Questo è un articolo print on demand.
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Da: preigu, Osnabrück, Germaniapreigu
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EUR 109,85
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Taschenbuch. Condizione: Neu. Wafer-Scale Integration | Wafer (Electronics), Trilogy Systems, Integrated Circuit, Massively Parallel, Supercomputer | Lambert M. Surhone (u. a.) | Taschenbuch | Englisch | 2026 | OmniScriptum | EAN 9786130999179 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49…078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu Print on Demand.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 136,00
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Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Please note that the content of this book primarily consists of articlesavailable from Wikipedia or other free sources online. Wafer-scaleintegration, WSI for short, is a yet-unused system of buildingvery-large integrated circuit netwo…rks that use an entire silicon waferto produce a single 'super-chip'. Through a combination of large sizeand reduced packaging, WSI could lead to dramatically reduced costs forsome systems, notably massively parallel supercomputers. The name istaken from the term very-large-scale integration, the current state ofthe art when WSI was being developed.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 80 pp. Englisch.
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Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, , GermaniaBuchWeltWeit Ludwig Meier e.K.
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EUR 213,99
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Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packa…ging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging. 528 pp. Englisch.
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- Print on Demand
Da: preigu, Osnabrück, Germaniapreigu
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EUR 186,70
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Buch. Condizione: Neu. Wafer Scale Integration | Earl E. Swartzlander Jr. | Buch | xx | Englisch | 1989 | Springer US | EAN 9780792390039 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
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Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000
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EUR 213,99
EUR 60,00 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging… the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 528 pp. Englisch.
