Wafer scale integration (40 risultati)

Hardcover. Ex-Corporate Library copy; with typical markings. Library label on front board and on spine tail. Slight spine twist. Pages clean, but for library markings. ; TEH22A; 274 pages; Ex-Library.

Condizione: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,700grams, ISBN:0852744978. …

Condizione: Good. 402 pp., hardcover, ex library, else text clean & binding tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.…

Condizione: Very Good. : Wafer Scale Integration es un libro editado por Earl E. Swartzlander, publicado en 1989 por Springer US. El libro aborda temas de ingeniería de sistemas, ingeniería informática y ciencia de la computación. Cuenta con 528 páginas y está disponible en formato electrónico y en versión impresa. El texto completo en línea está restringido a suscriptores. EAN: 9781461288961 Tipo: Libros Categoría: Tecnología|Ciencias Título: Wafer Scale Integration Autor: Earl E. Swartzlander Idioma: en Páginas: 528 Formato: Tapa blanda.…

hardcover. Condizione: Good. Good. Dust Jacket NOT present. CD WILL BE MISSING. . SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: New.

Condizione: New.

Condizione: New.

Condizione: New. In English.

Condizione: New. In English.

Condizione: New. Editor(s): Swartzlander, Earl E. Num Pages: 503 pages, black & white illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 28. Weight in Grams: 912. . 1989. Hardback. . . . .

Condizione: New. pp. 528.

Condizione: New. pp. 528.

Condizione: New. Editor(s): Swartzlander, Earl E. Num Pages: 503 pages, black & white illustrations. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156 x 28. Weight in Grams: 912. . 1989. Hardback. . . . . Books ship from the US and Ireland.…

Condizione: As New. Unread book in perfect condition.

Paperback. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condizione: As New. Unread book in perfect condition.

Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Hilger, Bristol, 1986. XII, 274 pages with some graphics, hardcover in dust jacket----former library book in good condition/ Proceedings of a Workshop held in Southampton from 10 july to 12 july 1985- 618 Gramm.

Condizione: Sehr gut. Zustand: Sehr gut | Produktart: Bücher | Keine Beschreibung verfügbar.

IEEE l99l 340pp. (ISBN 0-8l86-9126-3).

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-scale integration, WSI for short, is a yet-unused system of building very-large integrated circuit networks that use an entire silicon wafer to produce a single 'super-chip'. Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably massively parallel supercomputers. The name is taken from the term very-large-scale integration, the current state of the art when WSI was being developed. 80 pp. Englisch.…

Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-scale integration, WSI for short, is a yet-unused system of building very-large integrated circuit networks that use an entire silicon wafer to produce a single 'super-chip'. Through a combination of large size and reduced packaging, WSI could lead to dramatically reduced costs for some systems, notably massively parallel supercomputers. The name is taken from the term very-large-scale integration, the current state of the art when WSI was being developed.…

Condizione: new. Questo è un articolo print on demand.

Taschenbuch. Condizione: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Please note that the content of this book primarily consists of articles available from Wikipedia or other free sources online. Wafer-Level Packaging (WLP) refers to the technology of packaging an integrated circuit at wafer level. WLP is essentially a true chip scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging has the ability to enable true integration of wafer fab, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process undergone by a device from silicon start to customer shipment.…

Taschenbuch. Condizione: Neu. Wafer-Scale Integration | Wafer (Electronics), Trilogy Systems, Integrated Circuit, Massively Parallel, Supercomputer | Lambert M. Surhone (u. a.) | Taschenbuch | Englisch | 2026 | OmniScriptum | EAN 9786130999179 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu Print on Demand. …

Taschenbuch. Condizione: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Please note that the content of this book primarily consists of articlesavailable from Wikipedia or other free sources online. Wafer-scaleintegration, WSI for short, is a yet-unused system of buildingvery-large integrated circuit networks that use an entire silicon waferto produce a single 'super-chip'. Through a combination of large sizeand reduced packaging, WSI could lead to dramatically reduced costs forsome systems, notably massively parallel supercomputers. The name istaken from the term very-large-scale integration, the current state ofthe art when WSI was being developed.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 80 pp. Englisch.…

Taschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging. 528 pp. Englisch.…

Buch. Condizione: Neu. Wafer Scale Integration | Earl E. Swartzlander Jr. | Buch | xx | Englisch | 1989 | Springer US | EAN 9780792390039 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.…