Explains the latest design methods, modeling tools, simulation techniques, and manufacturing procedures of microelectronics packaging
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EUR 20,45 per la spedizione da U.S.A. a Italia
Destinazione, tempi e costiEUR 25,55 per la spedizione da U.S.A. a Italia
Destinazione, tempi e costiDa: Better World Books, Mishawaka, IN, U.S.A.
Condizione: Very Good. 1st Edition. Used book that is in excellent condition. May show signs of wear or have minor defects. Codice articolo GRP105030299
Quantità: 1 disponibili
Da: Better World Books, Mishawaka, IN, U.S.A.
Condizione: Good. 1st Edition. Used book that is in clean, average condition without any missing pages. Codice articolo 9707452-75
Quantità: 1 disponibili
Da: Wonder Book, Frederick, MD, U.S.A.
Condizione: Good. Good condition. Good dust jacket. A copy that has been read but remains intact. May contain markings such as bookplates, stamps, limited notes and highlighting, or a few light stains. NOT AVAILABLE FOR SHIPMENT OUTSIDE OF THE UNITED STATES. Codice articolo I10B-00858
Quantità: 1 disponibili
Da: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Hardcover. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9. Codice articolo G0442205783I3N00
Quantità: 1 disponibili
Da: ThriftBooks-Phoenix, Phoenix, AZ, U.S.A.
Hardcover. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9. Codice articolo G0442205783I3N00
Quantità: 1 disponibili
Da: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.
Hardcover. Condizione: Good. No Jacket. Missing dust jacket; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9. Codice articolo G0442205783I3N01
Quantità: 1 disponibili
Da: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Hardcover. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 3.9. Codice articolo G0442205783I3N00
Quantità: 1 disponibili
Da: WeBuyBooks, Rossendale, LANCS, Regno Unito
Condizione: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned. A few small marks or stains to the page edges/pages . Previous owners name inside the front page/cover. Codice articolo wbb0021758637
Quantità: 1 disponibili
Da: A Squared Books (Don Dewhirst), South Lyon, MI, U.S.A.
Hardcover. Condizione: Very Good. New York, 1988; black leather like cloth covered boards; corners and spine edges mildly scuffed; illustrated jacket with mild edge wear; 8vo, 7 3/4"-9 3/4" tall; "ADI Engineering Library" stamp on free front end paper, no other library markings; Interior is clean and unmarked; 1194 pages. Additional shipping charges may need to be requested due to size or weight of book. Codice articolo SKU1149536
Quantità: 1 disponibili
Da: Longs Peak Book Company, Loveland, CO, U.S.A.
Hardcover. Condizione: Near Fine. 1st Edition. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level. This copy is in excellent condition, a second printing of the first edition, a hardback with no dustjacket . Given the book's size and weight--3# 13oz-- shipping charges will be adjusted.The book will be carefully wrapped and boxed for safe shipping. Codice articolo 003422
Quantità: 1 disponibili