High Performance Design Automation for Multi-Chip Modules and Packages: 5 - Rilegato

 
9789810223076: High Performance Design Automation for Multi-Chip Modules and Packages: 5
Rilegato
ISBN 10: 9810223072 ISBN 13: 9789810223076
Casa editrice: World Scientific Pub Co Inc, 1996

Sinossi

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.

Le informazioni nella sezione "Riassunto" possono far riferimento a edizioni diverse di questo titolo.

Editore
World Scientific Pub Co Inc
Data di pubblicazione
1996
Lingua
Inglese
ISBN 10 
9810223072
ISBN 13 
9789810223076
Rilegatura
Copertina rigida
Numero di pagine
254
Redattore
Cho Jun-Dong, Franzon Paul D.
Contatto del produttore
non disponibile
Persona responsabile
non disponibile