Paperback. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Condizione: acceptable. Fairly worn, but readable and intact. If applicable: Dust jacket, disc or access code may not be included.
Paperback. Condizione: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
Da: Reader's Corner, Inc., Raleigh, NC, U.S.A.
Prima edizione
Hardcover. Condizione: Fine. No Jacket. 1st Edition. This is a fine hardcover first edition, first printing copy, no DJ, white/black spine, 314 pages with index.
Da: Bibliomadness, Worthington, MA, U.S.A.
Prima edizione
Hardcover. Condizione: Good. 1st Edition. Note older edition, copyright 2001. Good condition. Some edgewear. Used and bookstore stickers on spine and rear cover. A handful of pages with some pencil markings. All intact. Good reading or reference copy.
Lingua: Inglese
Editore: World Scientific Publishing Company, 1996
ISBN 10: 9810223072 ISBN 13: 9789810223076
Da: La bataille des livres, Pradinas, Francia
EUR 13,76
Quantità: 1 disponibili
Aggiungi al carrelloCondizione: Très bon. High Performance Design Automation for Multi-Chip Modules and Packages | Cho, Jun-Dong | World Scientific Pub Co Inc, 1996. In-8° cartonné, 254p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |.
Condizione: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships via media mail.
Condizione: New. Satisfaction Guaranteed or your money back.
paperback. Condizione: new.
paperback. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
hardcover. Condizione: Good. Hardcover ex-library with typical marks shows moderate cover wear. Text is unmarked. Ships FAST!
Da: BennettBooksLtd, Los Angeles, CA, U.S.A.
paperback. Condizione: New. In shrink wrap. Looks like an interesting title!
Lingua: Inglese
Editore: World Scientific Pub Co Inc, 1996
ISBN 10: 9810223072 ISBN 13: 9789810223076
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 149,95
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. Like NewLIKE NEW. book.
Da: Chiron Media, Wallingford, Regno Unito
EUR 185,01
Quantità: 5 disponibili
Aggiungi al carrelloHardcover. Condizione: New.
Lingua: Inglese
Editore: World Scientific Publishing Company, 1996
ISBN 10: 9810223072 ISBN 13: 9789810223076
Da: Aragon Books Canada, OTTAWA, ON, Canada
EUR 214,42
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: New.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 221,50
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. In.
Hardcover. Condizione: New. In shrink wrap. Looks like an interesting title!
EUR 238,59
Quantità: Più di 20 disponibili
Aggiungi al carrelloGebunden. Condizione: New. Far from being the passive containers for semiconductor devices of the past, the packages in today s high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance me.
Da: Mispah books, Redhill, SURRE, Regno Unito
EUR 279,83
Quantità: 1 disponibili
Aggiungi al carrelloHardcover. Condizione: Like New. Like New. book.
EUR 337,46
Quantità: 1 disponibili
Aggiungi al carrelloPaperback. Condizione: Brand New. 1st edition. 314 pages. 9.25x7.00x0.75 inches. In Stock.