Doane daryl ann (9 risultati)
Proceedings of the Tutorial Symposium on Semiconductor Technology
Doane, Daryl Ann & Fraser, David B. & Hess, Dennis W., Editors
Editore: The Electrochemical Society, Inc., Pennington, NJ, 1982
- Brossura
- Prima edizione
Da: Reader's Corner, Inc., Raleigh, NC, U.S.A.Reader's Corner, Inc.
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Molto buono
EUR 8,89
EUR 4,75 spedizioneSpedito in U.S.A.Quantità: 1 disponibili
Aggiungi al carrelloTrade Paperback. Condizione: Very Good. Condizione sovraccoperta: wraps. First. Proceedings of the Tutorial Symposium on Semiconductor Technology, May 10, 1982, Montreal, Canada.
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- Prima edizione
Da: Reader's Corner, Inc., Raleigh, NC, U.S.A.Reader's Corner, Inc.
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Come nuovo
EUR 35,13
EUR 4,75 spedizioneSpedito in U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: As New. No Jacket. 1st Edition. This is a fine, as new, hardcover first edition copy, no DJ, blue spine. 875 pages with index. Photos on request.
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Da: HPB-Red, Dallas, TX, U.S.A.HPB-Red
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Buono
EUR 90,45
EUR 3,24 spedizioneSpedito in U.S.A.Quantità: 1 disponibili
paperback. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
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Da: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 170,25
EUR 6,00 spedizioneSpedito in U.S.A.Quantità: 1 disponibili
paperback. Condizione: New. In shrink wrap. Looks like an interesting title.
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Da: Phatpocket Limited, Waltham Abbey, HERTS, Regno UnitoPhatpocket Limited
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Come nuovo
EUR 210,70
EUR 12,45 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Condizione: Like New. Used - Like New. Book is new and unread but may have minor shelf wear. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
- Brossura
Da: Ria Christie Collections, Uxbridge, Regno UnitoRia Christie Collections
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 227,78
EUR 14,01 spedizioneSpedito da Regno Unito a U.S.A.Quantità: Più di 20 disponibili
Condizione: New. In.
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Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
Contatta il venditoreVenditore con 4 stelleCondizione: Usato - Come nuovo
EUR 257,86
EUR 29,25 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Da: moluna, Greven, Germaniamoluna
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 246,91
EUR 48,99 spedizioneSpedito da Germania a U.S.A.Quantità: Più di 20 disponibili
Gebunden. Condizione: New. Far from being the passive containers for semiconductor devices of the past, the packages in today s high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance me.
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Da: AHA-BUCH GmbH, Einbeck, GermaniaAHA-BUCH GmbH
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 306,42
EUR 67,50 spedizioneSpedito da Germania a U.S.A.Quantità: 2 disponibili
Buch. Condizione: Neu. Neuware - Far from being the passive containers for semiconductor devices of the past, the packages in today's high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance measured in picoseconds continues to impro…ve, computer performance is expected to be in nanoseconds for the rest of this century -a factor of 1000 difference between on-chip and off-chip performance which is attributable to losses associated with the package. Thus the package, which interconnects all the chips to form a particular function such as a central processor, is likely to set the limits on how far computers can evolve. Multichip packaging, which can relax these limits and also improve the reliability and cost at the systems level, is expected to be the basis of all advanced computers in the future. In addition, since this technology allows chips to be spaced more closely, in less space and with less weight, it has the added advantage of being useful in portable consumer electronics as well as in medical, aerospace, automotive and telecommunications products. The multichip technologies with which these applications can be addressed are many. They range from ceramics to polymer-metal thin films to printed wiring boards for interconnections; flip chip, TAB or wire bond for chip-to-substrate connections; and air or water cooling for the removal of heat.
