Franzon paul d (19 risultati)
- Brossura
Da: HPB-Red, Dallas, TX, U.S.A.HPB-Red
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EUR 11,66
EUR 3,29 spedizioneSpedito in U.S.A.Quantità: 1 disponibili
Paperback. Condizione: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.
- Brossura
Da: ThriftBooks-Dallas, Dallas, TX, U.S.A.ThriftBooks-Dallas
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EUR 15,27
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
Paperback. Condizione: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.
- Brossura
Da: Better World Books: West, Reno, NV, U.S.A.Better World Books: West
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Molto buono
EUR 15,56
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
Condizione: Very Good. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
- Rilegato
- Prima edizione
Da: Reader's Corner, Inc., Raleigh, NC, U.S.A.Reader's Corner, Inc.
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Ottimo
EUR 49,73
EUR 4,83 spedizioneSpedito in U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: Fine. No Jacket. 1st Edition. This is a fine hardcover first edition, first printing copy, no DJ, white/black spine, 314 pages with index.
- Rilegato
- Prima edizione
Da: Bibliomadness, Worthington, MA, U.S.A.Bibliomadness
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Buono
EUR 76,86
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: Good. 1st Edition. Note older edition, copyright 2001. Good condition. Some edgewear. Used and bookstore stickers on spine and rear cover. A handful of pages with some pencil markings. All intact. Good reading or reference copy.
EDA for IC Implementation, Circuit Design, and Process Technology (Electronic Design Automation for Integrated Circuits Hdbk)
Scheffer, Louis [Editor]; Lavagno, Luciano [Editor]; Martin, Grant [Editor]; Martin, Grant [Editor]; Franzon, Paul D. [Contributor]; Schellenberg, Franklin [Contributor]; Khatri, Sunil P. [Contributor]; Hogan, James H. [Contributor]; Hutton, Michael D. [Contributor]; Bales, Mark [Contributor]; Dutton, Robert W. [Contributor]; Kariat, Vinod [Contributor]; Mo, Fan [Contributor]; Verghese, Nishath [Contributor]; Johnson, Mark Donald [Contributor]; Monteiro, Jose C. [Contributor]; Rutenbar, Rob A. [Contributor]; Blaauw, David T. [Contributor]; Todd, Robert A. [Contributor]; Stok, Leon [Contributor]; Roychowdhury, Jaijeet [Contributor]; Iverson, Ralph B. [Contributor]; Kahng, Andrew B. [Contributor]; Kuehlmann, Andreas [Contributor]; Kao, William H. [Contributor]; Cohn, John Maxwell [Contributor]; Gielen, Georges G.E. [Contributor]; Dragone, Nicola [Contributor]; Tiwari, Vivek [Contributor]; Shenoy, Narendra [Contributor]; Betz, Vaughn [Contributor]; Hathaway, David J. [Contributor]; Kan, E
Lingua: Inglese
Editore: CRC Press, 2006
Serie: Libro 1 di 2 - Electronic Design Automation for Integrated Circuits Hdbk
- Rilegato
Da: Swan Trading Company, GEORGETOWN, TX, U.S.A.Swan Trading Company
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Buono
EUR 76,88
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
hardcover. Condizione: Good. Hardcover ex-library with typical marks shows moderate cover wear. Text is unmarked. Ships FAST.
- Rilegato
Da: La bataille des livres, Pradinas, FranciaLa bataille des livres
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Ottimo
EUR 13,76
EUR 65,00 spedizioneSpedito da Francia a U.S.A.Quantità: 1 disponibili
Condizione: Très bon. High Performance Design Automation for Multi-Chip Modules and Packages | Cho, Jun-Dong | World Scientific Pub Co Inc, 1996. In-8° cartonné, 254p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |.…
- Brossura
Da: DeckleEdge LLC, Albuquerque, NM, U.S.A.DeckleEdge LLC
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 99,74
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
paperback. Condizione: new.
Lingua: Inglese
Editore: World Scientific Publishing Co Pte Ltd, Singapore, 1996
- Rilegato
Da: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 118,76
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…
- Brossura
Da: SHIMEDIA, Brooklyn, NY, U.S.A.SHIMEDIA
Contatta il venditoreVenditore con 4 stelleCondizione: Nuovo
EUR 135,62
Spedizione gratuitaSpedito in U.S.A.Quantità: 1 disponibili
Condizione: New. Satisfaction Guaranteed or your money back.
- Rilegato
Da: Russell Books, Victoria, BC, CanadaRussell Books
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 118,75
EUR 17,55 spedizioneSpedito da Canada a U.S.A.Quantità: 1 disponibili
hardcover. Condizione: New. Special order direct from the distributor.
- Rilegato
Da: Revaluation Books, Exeter, Regno UnitoRevaluation Books
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 149,25
EUR 14,53 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: Brand New. 254 pages. 10.25x7.00x0.75 inches. In Stock.
- Rilegato
Da: moluna, Greven, Germaniamoluna
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 109,48
EUR 48,99 spedizioneSpedito da Germania a U.S.A.Quantità: 1 disponibili
Condizione: New. KlappentextrnrnThe aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partiti.
- Rilegato
Da: Mispah books, Redhill, SURRE, Regno UnitoMispah books
Contatta il venditoreVenditore con 4 stelleCondizione: Usato - Come nuovo
EUR 152,10
EUR 29,07 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: Like New. Like NewLIKE NEW. book.
Lingua: Inglese
Editore: World Scientific Publishing Co Pte Ltd, Singapore, 1996
- Rilegato
Da: AussieBookSeller, Truganina, VIC, AustraliaAussieBookSeller
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 180,65
EUR 32,48 spedizioneSpedito da Australia a U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…
- Rilegato
Da: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 217,11
EUR 9,22 spedizioneSpedito in U.S.A.Quantità: 10 disponibili
Condizione: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . Books ship from the US and Ireland. …
Lingua: Inglese
Editore: CRC Press 2006-03-23, 2006
Serie: Libro 1 di 2 - Electronic Design Automation for Integrated Circuits Hdbk
- Rilegato
Da: Chiron Media, Wallingford, Regno UnitoChiron Media
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 207,35
EUR 18,01 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 5 disponibili
Hardcover. Condizione: New.
EDA for IC Implementation, Circuit Design, and Process Technology (Electronic Design Automation for Integrated Circuits Hdbk)
Scheffer, Louis [Editor]; Lavagno, Luciano [Editor]; Martin, Grant [Editor]; Martin, Grant [Editor]; Franzon, Paul D. [Contributor]; Schellenberg, Franklin [Contributor]; Khatri, Sunil P. [Contributor]; Hogan, James H. [Contributor]; Hutton, Michael D. [Contributor]; Bales, Mark [Contributor]; Dutton, Robert W. [Contributor]; Kariat, Vinod [Contributor]; Mo, Fan [Contributor]; Verghese, Nishath [Contributor]; Johnson, Mark Donald [Contributor]; Monteiro, Jose C. [Contributor]; Rutenbar, Rob A. [Contributor]; Blaauw, David T. [Contributor]; Todd, Robert A. [Contributor]; Stok, Leon [Contributor]; Roychowdhury, Jaijeet [Contributor]; Iverson, Ralph B. [Contributor]; Kahng, Andrew B. [Contributor]; Kuehlmann, Andreas [Contributor]; Kao, Willia
Lingua: Inglese
Editore: CRC Press, 2006
Serie: Libro 1 di 2 - Electronic Design Automation for Integrated Circuits Hdbk
- Rilegato
Da: BennettBooksLtd, Los Angeles, CA, U.S.A.BennettBooksLtd
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 254,28
EUR 6,10 spedizioneSpedito in U.S.A.Quantità: 1 disponibili
Hardcover. Condizione: New. In shrink wrap. Looks like an interesting title.
- Rilegato
Da: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrlandaKennys Bookshop and Art Galleries Ltd.
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 243,03
EUR 9,50 spedizioneSpedito da Irlanda a U.S.A.Quantità: 10 disponibili
Condizione: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . …
