Isbn: 9789810223076 - high performance design automation for multi-chip modules and packages: 5 (9 risultati)

Condizione: Très bon. High Performance Design Automation for Multi-Chip Modules and Packages | Cho, Jun-Dong | World Scientific Pub Co Inc, 1996. In-8° cartonné, 254p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |.…

Hardcover. Condizione: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.…

hardcover. Condizione: New. Special order direct from the distributor.

Condizione: New. KlappentextrnrnThe aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partiti.

Hardcover. Condizione: Brand New. 254 pages. 10.25x7.00x0.75 inches. In Stock.

Hardcover. Condizione: Like New. Like NewLIKE NEW. book.

Hardcover. Condizione: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.…

Condizione: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . Books ship from the US and Ireland. …

Condizione: New. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Editor(s): Cho, Jun Dong; Franzon, Paul D.; Sarrafzadeh, M. Series: Selected Topics in Electronics and Systems. Num Pages: 264 pages. BIC Classification: TJFC. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 220. . . 1996. hardcover. . . . . …