From Contamination to Defects, Faults and Yield Loss

Lingua: inglese

Editore: Springer US, Springer US Apr 1996, 1996

0792397142 / 9780792397144

Serie: Libro 28 di 40 - Frontiers in Electronic Testing

Da: buchversandmimpf2000, Emtmannsberg, BAYE, Germaniabuchversandmimpf2000

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Venditore AbeBooks dal 23 gennaio 2017

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Descrizione dell’articolo da parte del venditore

This item is printed on demand - Print on Demand Titel. Neuware -Over the years there has been a large increase in the functionality available on a single integrated circuit. This has been mainly achieved by a continuous drive towards smaller feature sizes, larger dies, and better packing efficiency. However, this greater functionality has also resulted in substantial increases in the capital investment needed to build fabrication facilities. Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield.Modern VLSI research and engineering (which includes design manufacturing and testing) encompasses a very broad range of disciplines such as chemistry, physics, material science, circuit design, mathematics and computer science. Due to this diversity, the VLSI arena has become fractured into a number of separate sub-domains with little or no interaction between them. This is the case with the relationships between testing and manufacturing.From Contamination to Defects, Faults and Yield Loss: Simulation and Applications focuses on the core of the interface between manufacturing and testing, i.e., the contamination-defect-fault relationship. The understanding of this relationship can lead to better solutions of many manufacturing and testing problems.Failure mechanism models are developed and presented which can be used to accurately estimate probability of different failures for a given IC. This information is critical in solving key yield-related applications such as failure analysis, fault modeling and design manufacturing. 172 pp. Englisch.…

Codice articolo 9780792397144

Titolo
From Contamination to Defects, Faults and Yield Loss
Autore
Wojciech Maly
Editore
Springer US, Springer US Apr 1996
Anno di pubblicazione
1996
Condizione
Neu
Rilegatura
Buch
Lingua
inglese
ISBN 10
0792397142
ISBN 13
9780792397144
Peso dell'articolo
430 grammi
Dimensioni
241x160x16 mm
Serie
Libro 28 di 40: Frontiers in Electronic Testing

buchversandmimpf2000

Emtmannsberg, BAYE, Germania

Venditore con 5 stelle

Venditore AbeBooks dal 23 gennaio 2017

Tariffe di spedizione da Germania a U.S.A.

ArticoloDa 60 a 60 giorni lavorativiDa 60 a 60 giorni lavorativi
Primo articoloEUR 60,00EUR 75,00
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