EUR 37,80
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Aggiungi al carrelloCondizione: New.
EUR 39,58
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Da: Books Puddle, New York, NY, U.S.A.
Condizione: New. 1st edition NO-PA16APR2015-KAP.
Da: Ria Christie Collections, Uxbridge, Regno Unito
EUR 37,82
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Aggiungi al carrelloCondizione: New. In English.
EUR 37,51
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Aggiungi al carrelloCondizione: New.
EUR 42,80
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Aggiungi al carrelloCondizione: As New. Unread book in perfect condition.
Lingua: Inglese
Editore: Springer International Publishing, 2007
ISBN 10: 3031014251 ISBN 13: 9783031014253
Da: AHA-BUCH GmbH, Einbeck, Germania
EUR 35,30
Quantità: 1 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
Da: Majestic Books, Hounslow, Regno Unito
EUR 43,62
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. Print on Demand.
Da: Biblios, Frankfurt am main, HESSE, Germania
EUR 44,71
Quantità: 4 disponibili
Aggiungi al carrelloCondizione: New. PRINT ON DEMAND.
Lingua: Inglese
Editore: Springer International Publishing Dez 2007, 2007
ISBN 10: 3031014251 ISBN 13: 9783031014253
Da: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germania
EUR 35,30
Quantità: 2 disponibili
Aggiungi al carrelloTaschenbuch. Condizione: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing. 104 pp. Englisch.
Lingua: Inglese
Editore: Springer, Berlin|Springer International Publishing|Morgan & Claypool|Springer, 2007
ISBN 10: 3031014251 ISBN 13: 9783031014253
Da: moluna, Greven, Germania
EUR 32,69
Quantità: Più di 20 disponibili
Aggiungi al carrelloCondizione: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices .