Garrou philip (3 risultati)
- Rilegato
Da: Anybook.com, Lincoln, Regno UnitoAnybook.com
Contatta il venditoreVenditore con 5 stelleCondizione: Usato - Buono
EUR 62,76
EUR 18,44 spedizioneSpedito da Regno Unito a U.S.A.Quantità: 1 disponibili
Condizione: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1650grams, ISBN:9780070228948.
Editore: Electronic Industry Press, 1991
- Brossura
Da: liu xing, Nanjing, JS, Cinaliu xing
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 86,07
EUR 15,59 spedizioneSpedito da Cina a U.S.A.Quantità: 1 disponibili
paperback. Condizione: New. Language:Chinese.Paperback. Publisher: Electronic Industry Press. This book from the circuit design. material properties. process assembly. packaging. thermal design and test other aspects of comprehensive.
3D Integration Handbook Volume 3 Three-Dimensional Process Technology(Chinese Edition)
[ MEI ] FEI LI PU· JIA LUO ( Philip Garrou ) . [ RI ] XIAO LIU GUANG ZHENG ( Mitsumasa Koyanagi ) . [ DE ] BI DE· LA MU ( Peter Ramm ) . WU DAO WEI . WANG WEI . LIU JIAN JUN . YU HUAN DENG YI
Lingua: Inglese
- Rilegato
Da: liu xing, Nanjing, JS, Cinaliu xing
Contatta il venditoreVenditore con 5 stelleCondizione: Nuovo
EUR 142,16
EUR 15,59 spedizioneSpedito da Cina a U.S.A.Quantità: 3 disponibili
Hardcover. Condizione: New. HardCover.Pub Date:2022-10 Pages:369 Language:ChinesePublisher:China Aerospace PressSelf-operated3D Integration Handbook Volume 3 Three-Dimensional Process Technologyis divided into 22 chapters. namely: 3D IC integration since 2008. main applications and market trends of 3D integration and interposer…technology. economic drivers and barriers to 2.5D/3D integration. interposer technology. TSV manufacturing overview. TSV unit process and integration. TSV preparation of ASET. laser-assisted wafe.
